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Lab-on-chip systems are based on components to transport, mix, separate and analyse small volumes of different fluids. The consecutive integration of more complex functions into a single and compact chip demands on multilayer systems. As the classical production using a stacking and joining of single processed layers is elaborate and limited in terms of multilayer structures, an uprising trend to fabricate those devices is the internal, three dimensional processing of transparent substrates by using ultrashort laser pulses. In this study, we report on the generation of internal hollow architectures created by focused 514nm femtosecond laser pulses inside optical polymer bulk materials of different polymers. The three-dimensional channel layout is implemented by moving the sample using three-dimensional motorized stages, allowing arbitrary complex shaped internal channel architectures. Size and cross sectional shape of a single internal generated microchannel are determined by the intensity distribution of the focal voxel. In particular, we show a comprehensive parameter study to improve this laser process with respect to a higher processing speed and stability.
We report on an optical setup for multi Bessel beam processing combining a refractive axicon and a spatial light modulator.
Based on their particular beam profile, Bessel beams exhibit various advantages over conventional Gaussian beams for
ultrashort pulsed laser processing. Especially for micromachining of transparent materials, applications such as micro-hole
drilling or the generation of voids benefit from the increased focal length of the applied Bessel beam. In addition, on
account of the significantly increased average output power of industrial ultrashort pulsed lasers over the last years, there
is a high demand on multi spot applications for using the available laser power in efficient production processes. Our
optical concept combines the dynamic possibilities of beam splitting using spatial light modulator with the benefits of
Bessel beams facilitating multi Bessel beam processing.