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We report on ultraviolet ultrashort pulsed laser processing of silicon carbide. Laser ablated cavities are evaluated with respect to their ablation rates, surface roughness and overall quality by varying the laser pulse fluence. Using this type of laser, high edge quality and surface roughness down to 107 nm can be achieved with an ablation efficiency of up to 0.228 mm 3 W −1 min −1. Functional surfaces are produced by generating laser induced periodic surface structures. The comparison with infrared wavelength underlines the advantages of the ultraviolet wavelength for laser micro machining this material. Significant differences with respect to the measured ablation depths and roughness as well as generated micro-and nanostructures appear. While infrared ablation is dominated by a chipping mechanism above a critical fluence of 9.93 Jcm −2 , higher ablation rates are observed with strong quality losses at the same time. In comparison to the infrared emission wavelength, in general , a significantly higher processing quality is achieved with the ultraviolet emission wavelength. In addition, the influence of spot size and repetition rate in UV processing is investigated. By increasing these parameters, a process acceleration without quality losses is enabled. The generation of a sophisticated microstructure exemplifies the advantages of processing silicon carbide with the UV laser reported here.
We report on an experimental study of laser microvia percussion drilling of Ajinomoto build-up film (ABF) material using an ultrashort pulsed laser in the ultraviolet region. In order to optimize the drilling quality in terms of the fabricated taper and microvia diameter, the
MHz burst mode is used in combination with both a Gaussian and a top-hat laser intensity distribution. To evaluate the influence of the top-hat beam shape on defocusing, microvias were drilled at different z-positions in the range of 200 μm evenly distributed around the focal plane. The drilling quality was evaluated by laser scanning microscopy and metallography. When using a top-hat beam shape, a reduced taper of down to 26.8 % on average is achieved compared to a Gaussian beam. For the application of 3 intra-burst pulses, we find an improvement of the taper by 11.6% compared to the single pulse mode due to the increasing heat accumulation. Using a top-hat beam shape in combination with the MHz burst mode, an 18.2 % reduction in laser drilling time for a microvia with a similar taper is remarkable, demonstrating the high potential for scaling throughput in electronics manufacturing.
While Bragg grating-based optical devices have shown promising performances for pressure sensing applications, their sensitivity, especially in the low-pressure regime, is unsatisfying and needs to be optimized by elaborate designs, such as cantilevers or other extrinsic mechanical transducers. This contribution demonstrates and discusses a novel concept for optical pressure sensors based on polymer planar Bragg gratings. Waveguide and Bragg grating are fabricated underneath the surface of a temperature-stable and humidity-insensitive cyclic olefin copolymer substrate by means of a femtosecond laser. Based on the employed direct-writing procedure, in combination with adaptive, in-situ beam shaping with a spatial light modulator, writing depth, i.e., location of the photonic structures within the substrate, as well as Bragg grating periodicity and positioning can be deliberately chosen. Afterwards, the polymer substrate is post-processed with a high-precision micro mill, so a diaphragm comprising the integrated photonic structures is generated. The resulting diaphragm exhibits a thickness of 300 µm and a diameter of 10 mm. Finally, the optical sensor is packaged and sealed to form an air-filled gas pocket underneath the diaphragm. Deformations of the diaphragm by external pressure changes translate to strain variations along the waveguide axis and thus perturb the Bragg grating period. This leads to changes in the grating’s wavelength of main reflection, which can be evaluated in order to quantify the relative external pressure. With this straightforward optical sensor concept, pressure sensitivities up to 39 pm kPa-1, within relative pressures ranges from 78 kPa to 372 kPa, are achieved.
We report on an optical setup for multi Bessel beam processing combining a refractive axicon and a spatial light modulator.
Based on their particular beam profile, Bessel beams exhibit various advantages over conventional Gaussian beams for
ultrashort pulsed laser processing. Especially for micromachining of transparent materials, applications such as micro-hole
drilling or the generation of voids benefit from the increased focal length of the applied Bessel beam. In addition, on
account of the significantly increased average output power of industrial ultrashort pulsed lasers over the last years, there
is a high demand on multi spot applications for using the available laser power in efficient production processes. Our
optical concept combines the dynamic possibilities of beam splitting using spatial light modulator with the benefits of
Bessel beams facilitating multi Bessel beam processing.