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Evaluation of an ultrashort pulsed laser robot system for flexible and large-area micromachining
(2023)
We report for the first time on the realization, characterization and application of an ultrashort pulsed laser robot system for flexible and large-area 2D and 3D laser micromachining with 6 articulated axes. To characterize the dynamic positioning of the laser beam during and after axes movement, CMOS image sensors were integrated into the beam path. A method introduced for the alignment of the optical axes allows a reduction of the deviations in laser beam positioning to less than 141.8 ± 92.9 μm within a 110° rotation range of axis 4. In addition, a high laser beam positioning repeatability of less than 102.2 μm is demonstrated over a total period of 14 h for a movement of axis 5 within a range of 0° to 90°. Initial laser cutting, laser structuring and laser marking applications on automotive dashboards and glass substrates are presented for flexible and large area 2D and 3D manufacturing. By applying a special laser cutting strategy for processing AF 32 eco thin glass, high cutting quality is achieved with a taper of up to 96.3% without the generation of cracks, demonstrating the innovative potential of the high-precision laser robot system. Nonetheless, different identified inherent influences of each axis 1–5 during robot axis movement demand for an innovative beam stabilization concept to achieve high precision in laser beam positioning.
We report on a comprehensive study of laser percussion microvia drilling of Ajinomoto build-up film (ABF) material using an ultrashort pulsed laser in MHz burst mode. After laser processing, microvia drilling quality is being evaluated by the fabricated diameter and taper using laser scanning microscopy and metallography. The influences of the incubation effect, heat accumulation and shielding effects as a result of pulse to pulse interactions are being discussed on the ablation threshold, penetration depth and laser microvia drilling quality. We find that an increasing heat accumulation in MHz burst mode processing is responsible for the void formation and delamination of the insulating ABF layer. Therefore, the parameter clearance is introduced to evaluate these effects on the microvia sidewalls. For a comparable clearance, applying 2 intra-burst pulses achieves an average reduced taper of down to 19.5% compared to single pulse mode. At the same time, a reduced laser drilling time of 16.7% per microvia highlights the enormous potential of the MHz burst mode for laser drilling of ABF material in printed circuit board fabrication.
This paper presents an optimized laser-bonding process for piezoelectric energy-harvesters based on thin fluorinated-ethylene-propylene (FEP) foils, using an ultra-short-pulse(USP) laser. Due to the minimized thermal stress in the material during bonding, achieved bypulse durations of few picoseconds, we created seams down to 40μm width without generatingholes in the 12.5μm thick FEP-foils. Using a galvanometer scanning system allowed for fastbonding-speed up to several centimeters per second, making the process also suitable for largestructures and areas. The achieved bond strength of the seams under influence of shearingstress was examined using tensile testing, which showed a sufficient strength of about 25 % of the maximum strength of an unbonded, single layer of FEP.
We report on the fabrication of rotationally symmetrical geometries with ultrashort laser pulses impinging the constant rotating workpiece tangentially. This particular micro machin-ing of geometry is referred to as laser turning, upon which the laser beam is, in general, orient-ed perpendicularly to the rotational axis and tangentially to the work piece. The target geome-try is realized by moving the constantly rotating specimen according to the specified geometry along the focused laser spot. In contrast to mechanical turning, laser turning induces a mini-mized amount of lateral forces through friction that might deteriorate the geometry. In this study, laser turning is examined for stellite as a function of pulse energy and pulse length in the range between 240 fs and 10 ps. Shorter pulse lengths and higher pulse energies increase the achievable ablation rate, while in the pulse length regime of below 1 ps lower roughness is achieved. With a maximum ablation rate of 1.27 mm³/min and a minimum roughness of 0.17 µm, laser turning combines both, fast processing and high surface quality.
We report on the effect of different transversal beam shapes on the efficiency of ablation processes and the resulting surface characteristics. A possibility to efficiently apply ultrashort pulsed lasers with high average power is beam shaping. By using a cooled reflective based liquid crystal spatial light modulator to generate different spot distributions, it is possible to spatially allocate the available power to avoid excessive high fluences. In our experiments, we determine the optimal fluence to ablate the maximum volume per watt to be in the range of 0.2-0.4 J/cm². Based on this fluence, we increase the number of spots from one to a maximum of twenty to ablate steel in a multilayer scanning-based process. In this context, we examine the influence of different separation distances between the spots on the ablation efficiency and roughness. Subsequently to these investigations, we develop an efficient roughing process with higher ablation rates and a nearly constant roughness.
We report on an optical setup for multi Bessel beam processing combining a refractive axicon and a spatial light modulator.
Based on their particular beam profile, Bessel beams exhibit various advantages over conventional Gaussian beams for
ultrashort pulsed laser processing. Especially for micromachining of transparent materials, applications such as micro-hole
drilling or the generation of voids benefit from the increased focal length of the applied Bessel beam. In addition, on
account of the significantly increased average output power of industrial ultrashort pulsed lasers over the last years, there
is a high demand on multi spot applications for using the available laser power in efficient production processes. Our
optical concept combines the dynamic possibilities of beam splitting using spatial light modulator with the benefits of
Bessel beams facilitating multi Bessel beam processing.
This article discusses the process of the laser turning of rotational symmetric, cylindrical components using ultrashort laser pulses with respect to the geometrical conditions and the resulting energy distribution during the laser turning process. As a result, process predictions and potential process optimizations are feasible. Particular attention is drawn to the laser spot formation on the cylindrical surface of the work piece in conjunction with the positioning of the laser beam relative to the rotation axis of the specimen. Based on fundamental calculations and experimental results, an optimum processing strategy is discussed, whereat the use of a trepanning optic in the laser turning process and the forming of a particular surface structure is additionally being issued.
We report on laser drilling borehole arrays using ultrashort pulsed lasers with a particular focus on reducing the inadvertent heat accumulation across the workpiece by optimizing the drilling sequence. For the optimization, evolutionary algorithms are used and their results are verified by thermal simulation using Comsol and experimentally evaluated using a thermal imaging camera. To enhance process efficiency in terms of boreholes drilled per second, multi-spot approaches are employed using a spatial light modulator. However, as higher temperatures occur across the workpiece when using simultaneous multi-spot drilling as compared to a single-spot process, a subtle spatial distribution and sequence of the multi-spot approach has to be selected in order to limit the
resulting local heat input over the processing time. Different optimization approaches based on evolutionary algorithms aid to select those drilling sequences which allow for the combination of a high efficiency of multi-spot profiles, a low-generated process temperature and a high-component quality. In particular, using a 4 x 4 laser spot array allows for the drilling of 40,000 boreholes in less than 76 s (526 boreholes/s) with a reduced temperature increase by about 35%, as compared to a single spot process when employing an optimized drilling sequence.
Multi-Bessel Beams Generated by an Axicon and a Spatial Light Modulator for Drilling Applications
(2023)
We report on an optical setup to generate multi-Bessel beam profiles combining a refractive axicon and a spatial light modulator. Based on their particular beam profile, Bessel beams offer advantageous properties for micro drilling processes and internal volume processing, especially for transparent materials. In addition, the laser power of industrial, ultrashort pulsed lasers has increased significantly over the last few years, offering the possibility for highly efficient processes using multi-spot profiles. Our optical concept combines the dynamic possibilities of beam splitting using a spatial light modulator with the benefits of Bessel beams, which facilitates multi-Bessel beam processing. Beside the simulation and experimental evaluation of the generated multi-Bessel beams, we exemplify the applicability of the developed module for the perforation of thin metal foils by micro drilling.