MetadatenAuthor: | David Stenzel, Christian Schwarzer, Michael Schnepf, Wolfgang Schmitt, Thomas Blank, Jörg Franke, Michael Kaloudis |
---|
Parent Title (English): | 22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy |
---|
Document Type: | Conference Proceeding |
---|
Language: | English |
---|
Year of Completion: | 2019 |
---|
Release Date: | 2019/12/05 |
---|
Tag: | Sintern, Silber, Kupfer |
---|
GND Keyword: | Leistungselektronik; Sintern |
---|
Urheberrecht: | 1 |
---|
research focus : | Intelligent Systems / Electronics and Electric Drives |
---|
| Materials / Clean Tech |
---|
| Materials / Material Testing & Sensor Technology |
---|
Licence (German): | Keine Lizenz - es gilt das deutsche Urheberrecht |
---|