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Analysing the growth of intermetallic compounds in lead-free solder joints by differential scanning calorimetry measurements
Author: | Timo Schreck, Anna Schnorpfeil, Michael Kaloudis |
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DOI: | https://doi.org/10.1007/s10853-012-7035-5 |
Parent Title (English): | Journal of Materials Science |
Document Type: | Article |
Language: | English |
Year of Completion: | 2013 |
Release Date: | 2013/12/13 |
Tag: | intermetallic compounds |
GND Keyword: | Differential scanning calorimetry; Lötverbindung |
Volume: | 48(2013) |
Issue: | 6 |
First Page: | 2476 |
Last Page: | 2484 |
research focus : | Intelligent Systems / Electronics and Electric Drives |
Materials / Clean Tech | |
Materials / Material Testing & Sensor Technology | |
Licence (German): | Keine Lizenz - es gilt das deutsche Urheberrecht |