Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates in High Temperature Applications
Author: | Alexander Hensel, Frederick Roth, Corinna Merz, Jörg Franke, Michael Kaloudis |
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Parent Title (English): | 22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy |
Document Type: | Conference Proceeding |
Language: | English |
Year of Completion: | 2019 |
Date of first Publication: | 2019/05/19 |
Release Date: | 2019/12/05 |
Tag: | 3D,; Kupfer; Silbersintern; Sintern |
GND Keyword: | Sintern; Hochtemperatur |
Urheberrecht: | 1 |
research focus : | Intelligent Systems / Electronics and Electric Drives |
Materials / Clean Tech | |
Materials / Material Testing & Sensor Technology | |
Licence (German): | Keine Lizenz - es gilt das deutsche Urheberrecht |