Computed-Tomography-Based Analysis of Voids in SnBi57Ag1 Solder Joints and Their Influence on the Reliability
Author: | Miriam Rauer, Antje Volkert, Stefan Härter, Timo Schreck, Michael Kaloudis |
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Parent Title (English): | Journal of Failure Analysis and Prevention |
Editor: | Michael Stevenson |
Document Type: | Article |
Language: | German |
Year of Completion: | 2014 |
Date of first Publication: | 2014/03/15 |
Release Date: | 2015/06/08 |
GND Keyword: | Computertomographie; Löten |
Volume: | 14 |
Issue: | 3 |
First Page: | 272 |
Last Page: | 281 |
Urheberrecht: | 0 |
research focus : | Intelligent Systems / Electronics and Electric Drives |
Intelligent Systems / Intelligent Sensors and Signals | |
Materials / Clean Tech | |
Materials / Material Testing & Sensor Technology | |
Licence (German): | Keine Lizenz - es gilt das deutsche Urheberrecht |