The Effect of Thermal Stress on the Reliability of low Ag Solder Joints in High Power LEDs
Author: | Miriam Rauer, Timo Schreck, Stefan Härter, Michael Kaloudis |
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Parent Title (English): | 20th European Microelectronics and Packaging Conference (EMPC) & Exhibition, 14.-16.09.2015 |
Document Type: | Conference Proceeding |
Language: | English |
Year of Completion: | 2015 |
Release Date: | 2016/03/22 |
GND Keyword: | Lumineszenzdiode; Thermische Belastung; Zuverlässigkeit; Lötverbindung |
Page Number: | 6 |
First Page: | 1 |
Last Page: | 6 |
Urheberrecht: | 1 |
research focus : | Intelligent Systems / Electronics and Electric Drives |
Materials / Clean Tech | |
Materials / Material Testing & Sensor Technology | |
Licence (German): | Keine Lizenz - es gilt das deutsche Urheberrecht |