Investigation of a Sintering Process for Micro-Scale Copper Material
Author: | Wolfgang Schmitt, Michael Schnepf, Jörg Franke, Michael Kaloudis |
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Parent Title (English): | 2019 SMTA Electronic in Harsh Environments Conference |
Document Type: | Conference Proceeding |
Language: | English |
Year of Completion: | 2019 |
Date of first Publication: | 2019/04/04 |
Release Date: | 2019/12/04 |
GND Keyword: | Kupfer; Sintern |
Volume: | 2019 |
Urheberrecht: | 1 |
research focus : | Intelligent Systems / Electronics and Electric Drives |
Materials / Clean Tech | |
Materials / Material Testing & Sensor Technology | |
Licence (German): | Keine Lizenz - es gilt das deutsche Urheberrecht |