Laser-bonding of FEP/FEP interfaces for a flexiblemanufacturing process of ferroelectrets

  • This paper presents an optimized laser-bonding process for piezoelectric energy-harvesters based on thin fluorinated-ethylene-propylene (FEP) foils, using an ultra-short-pulse(USP) laser. Due to the minimized thermal stress in the material during bonding, achieved bypulse durations of few picoseconds, we created seams down to 40μm width without generatingholes in the 12.5μm thick FEP-foils. Using a galvanometer scanning system allowed for fastbonding-speed up to several centimeters per second, making the process also suitable for largestructures and areas. The achieved bond strength of the seams under influence of shearingstress was examined using tensile testing, which showed a sufficient strength of about 25 % of the maximum strength of an unbonded, single layer of FEP.

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Author:Dennis Flachs, Florian Emmerich, Gian-Luca Roth, Ralf HellmannORCiD, Christiane Thielemann
DOI:https://doi.org/10.1088/1742-6596/1407/1/012107
Parent Title (English):Journal of Physics: Conference Series
Document Type:Article
Language:English
Year of Completion:2019
Release Date:2020/04/14
GND Keyword:Ultrakurzzeitlaser; Piezoelektrizität
Volume:1407
Issue:012107
First Page:1
Last Page:5
Urheberrecht:0
research focus :Intelligent Systems / Clean Tech
Intelligent Systems / Intelligent Sensors and Signals
Materials / Innovative Material Processing
Materials / Material Testing & Sensor Technology
Licence (German):Keine Lizenz - es gilt das deutsche Urheberrecht
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