TY - JOUR A1 - Häfner, Tom A1 - Bischoff, Kay A1 - Helm, Jonas A1 - Kunz, Tim A1 - Rung, Stefan A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - KEINE FREISCHALTUNG - Urheberrecht 0 bei Dokument mit Volltext Picosecond laser microvia drilling of ABF material using MHz burst mode JF - Materials Research Express N2 - We report on a comprehensive study of laser percussion microvia drilling of Ajinomoto build-up film (ABF) material using an ultrashort pulsed laser in MHz burst mode. After laser processing, microvia drilling quality is being evaluated by the fabricated diameter and taper using laser scanning microscopy and metallography. The influences of the incubation effect, heat accumulation and shielding effects as a result of pulse to pulse interactions are being discussed on the ablation threshold, penetration depth and laser microvia drilling quality. We find that an increasing heat accumulation in MHz burst mode processing is responsible for the void formation and delamination of the insulating ABF layer. Therefore, the parameter clearance is introduced to evaluate these effects on the microvia sidewalls. For a comparable clearance, applying 2 intra-burst pulses achieves an average reduced taper of down to 19.5% compared to single pulse mode. At the same time, a reduced laser drilling time of 16.7% per microvia highlights the enormous potential of the MHz burst mode for laser drilling of ABF material in printed circuit board fabrication. KW - Ultrakurzzeitlaser KW - Pikosekundenbereich Y1 - 2023 VL - 10 IS - 9 SP - 096301 EP - 096311 ER -