TY - JOUR A1 - Bischoff, Kay A1 - Mücke, Dominik A1 - Roth, Gian-Luca A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - UV-Femtosecond-Laser Structuring of Cyclic Olefin Copolymer JF - Polymers N2 - We report on the laser ablation of cyclic olefin copolymer using an amplified ultrashort pulsed laser in the ultraviolet spectral range. In addition to a high ablation depth per laser-structured layer up to 74 μm at a fluence of 22 J cm−2, an excellent mean roughness 𝑅𝑎 of laser-patterned surfaces down to 0.5 μm is demonstrated. Furthermore, with increasing fluence, increasing ablation efficiencies up to 2.5 mm3 W−1 min−1 are determined. Regarding the quality of the ablation, we observed steep ablation flanks and low debris formation, though for fluences above 10.5 J cm−2 the formation of troughs was observed, being attributed to multiple reflections on the ablation flanks. For comparison, laser ablation was performed under identical conditions with an infrared laser wavelength. The results highlight that UV ablation exhibits significant advantages in terms of ablation efficiency, surface roughness and quality. Moreover, our results show that a larger UV focus spot accelerates the ablation process with comparable quality, paving the way for high-power UV ultrashort pulsed lasers towards an efficient and qualitative tool for the laser machining of cyclic olefin copolymer. The production of complex microfluidics further underlines the suitability of this type of laser. KW - Femtosekundenlaser Y1 - 2022 U6 - https://doi.org/https://doi.org/10.3390/polym14142962 VL - 14 IS - 14 SP - 2962 EP - 2962 ER - TY - CHAP A1 - Bischoff, Kay A1 - Mücke, Dominik A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - UV-Femtosecond-Laser Structuring of Silicon Carbide T2 - International Congress on Applications of Lasers & Electro-Optics (ICALEO) 2023 N2 - We report on ultraviolet ultrashort pulsed laser processing of silicon carbide. Laser ablated cavities are evaluated with respect to their ablation rates, surface roughness and overall quality by varying the laser pulse fluence. Using this type of laser, high edge quality and surface roughness down to 107 nm can be achieved with an ablation efficiency of up to 0.228 mm 3 W −1 min −1. Functional surfaces are produced by generating laser induced periodic surface structures. The comparison with infrared wavelength underlines the advantages of the ultraviolet wavelength for laser micro machining this material. Significant differences with respect to the measured ablation depths and roughness as well as generated micro-and nanostructures appear. While infrared ablation is dominated by a chipping mechanism above a critical fluence of 9.93 Jcm −2 , higher ablation rates are observed with strong quality losses at the same time. In comparison to the infrared emission wavelength, in general , a significantly higher processing quality is achieved with the ultraviolet emission wavelength. In addition, the influence of spot size and repetition rate in UV processing is investigated. By increasing these parameters, a process acceleration without quality losses is enabled. The generation of a sophisticated microstructure exemplifies the advantages of processing silicon carbide with the UV laser reported here. KW - Femtosekundenlaser KW - Siliciumcarbid Y1 - 2023 ER - TY - JOUR A1 - Bischoff, Kay A1 - Mücke, Dominik A1 - Schubert, Andreas A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Rheological Investigation of Highly Filled Copper(II) Oxide Nanosuspensions to Optimize Precursor Particle Content in Reductive Laser-Sintering JF - Liquids N2 - In this article, the particle concentration of finely dispersed copper(II) oxide nanosuspensions as precursors for reductive laser sintering (RLS) is optimized on the basis of rheological investigations. For this metallization process, a smooth, homogeneous and defect-free precursor layer is a prerequisite for adherent and reproducible copper structures. The knowledge of the rheological properties of an ink is crucial for the selection of a suitable coating technology as well as for the adjustment of the ink formulation. Different dilutions of the nanosuspension were examined for their rheological behavior by recording flow curves. A strong shear thinning behavior was found and the viscosity decreases exponentially with increasing dilution. The viscoelastic behavior was investigated by a simulated doctor blade coating process using three-interval thixotropy tests. An overshoot in viscosity is observed, which decreases with increasing thinning of the precursor. As a comparison to these results, doctor blade coating of planar glass and polymer substrates was performed to prepare precursor layers for reductive laser sintering. Surface morphology measurements of the resulting coatings using laser scanning microscopy and rheological tests show that homogeneous precursor layers with constant thickness can be produced at a particle–solvent ratio of 1.33. A too-high particle content results in an irregular coating layer with deep grooves and a peak-to-valley height Sz of up to 7.8 μm. Precise dilution control allows the fabrication of smooth surfaces with a Sz down to 1.5 μm. KW - Laserstrahlsintern Y1 - 2024 U6 - https://doi.org/http://dx.doi.org/10.3390/liquids4020019 SN - 2673-8015 VL - 4 IS - 2 SP - 382 EP - 392 PB - MDPI AG ER - TY - JOUR A1 - Yang, Yongting A1 - Bischoff, Kay A1 - Mücke, Dominik A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - UV-ultrashort pulsed laser ablation of fused silica JF - Journal of Laser Applications N2 - The authors report on ultraviolet ultrashort pulsed laser ablation of fused silica and compare the achievable micromachining results to those obtained by using the fundamental emission wavelength in infrared. Ablation in ultraviolet reveals a stable efficiency for increasing fluences, whereas using an infrared beam exhibits a decreasing trend of the ablation efficiency at higher and increasing fluences. In addition, a significant improvement in the surface quality is found by using an ultraviolet wavelength in a fluence range up to 20 J/cm2 compared to infrared, e.g., revealing an Ra of down to 0.45 μm on using the ultraviolet wavelength compared to Ra = 0.56 μm on using infrared at fluences up 15 J/cm2. Moreover, taking advantage of the high available pulse energy, the authors compare the achievable ablation efficiency and surface roughness using a conventionally focused ultraviolet beam and a defocused ultraviolet beam, finding that the defocused ultraviolet beam possesses a processing quality comparable to that of the focused beam. Finally, the authors exemplify the potential of ultraviolet ultrashort pulsed laser ablation by using a Tesla mixer for microfluidic integration of fused silica. KW - Laserablation KW - Quarzglas KW - Laserbestrahlung Y1 - 2024 U6 - https://doi.org/http://dx.doi.org/10.2351/7.0001197 SN - 1042-346X VL - 36 IS - 1 PB - Laser Institute of America ER - TY - CHAP A1 - Franz, Daniel A1 - Mücke, Dominik A1 - Kunz, Tim A1 - Rung, Stefan A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - UV picosecond laser drilling of ABF film material for printed circuit boards using laser burst mode and beam shaping T2 - International Congress on Applications of Lasers & Electro-Optics (ICALEO) 2023 N2 - We report on an experimental study of laser microvia percussion drilling of Ajinomoto build-up film (ABF) material using an ultrashort pulsed laser in the ultraviolet region. In order to optimize the drilling quality in terms of the fabricated taper and microvia diameter, the MHz burst mode is used in combination with both a Gaussian and a top-hat laser intensity distribution. To evaluate the influence of the top-hat beam shape on defocusing, microvias were drilled at different z-positions in the range of 200 μm evenly distributed around the focal plane. The drilling quality was evaluated by laser scanning microscopy and metallography. When using a top-hat beam shape, a reduced taper of down to 26.8 % on average is achieved compared to a Gaussian beam. For the application of 3 intra-burst pulses, we find an improvement of the taper by 11.6% compared to the single pulse mode due to the increasing heat accumulation. Using a top-hat beam shape in combination with the MHz burst mode, an 18.2 % reduction in laser drilling time for a microvia with a similar taper is remarkable, demonstrating the high potential for scaling throughput in electronics manufacturing. KW - Pikosekundenbereich KW - Laserbohren Y1 - 2023 ER -