TY - CHAP A1 - Hensel, Alexander A1 - Roth, Frederick A1 - Merz, Corinna A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates in High Temperature Applications T2 - 22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy KW - 3D, KW - Kupfer KW - Sintern KW - Silbersintern KW - Sintern KW - Hochtemperatur Y1 - 2019 ER -