TY - JOUR A1 - Lutz, Christian A1 - Helm, Jonas A1 - Tschirpke, Katrin A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Drilling Sequence Optimization Using Evolutionary Algorithms to Reduce Heat Accumulation for Femtosecond Laser Drilling with Multi-Spot Beam Profiles JF - MDPI Materials N2 - We report on laser drilling borehole arrays using ultrashort pulsed lasers with a particular focus on reducing the inadvertent heat accumulation across the workpiece by optimizing the drilling sequence. For the optimization, evolutionary algorithms are used and their results are verified by thermal simulation using Comsol and experimentally evaluated using a thermal imaging camera. To enhance process efficiency in terms of boreholes drilled per second, multi-spot approaches are employed using a spatial light modulator. However, as higher temperatures occur across the workpiece when using simultaneous multi-spot drilling as compared to a single-spot process, a subtle spatial distribution and sequence of the multi-spot approach has to be selected in order to limit the resulting local heat input over the processing time. Different optimization approaches based on evolutionary algorithms aid to select those drilling sequences which allow for the combination of a high efficiency of multi-spot profiles, a low-generated process temperature and a high-component quality. In particular, using a 4 x 4 laser spot array allows for the drilling of 40,000 boreholes in less than 76 s (526 boreholes/s) with a reduced temperature increase by about 35%, as compared to a single spot process when employing an optimized drilling sequence. KW - USP laser processing KW - Laser drilling KW - Optimization of heat accumulation KW - Evolutionary Algorithms KW - Thermal simualtions KW - Laserbohren KW - Ultrakurzzeitlaser Y1 - 2023 UR - https://www.mdpi.com/1996-1944/16/17/5775 U6 - https://doi.org/10.3390/ma16175775 VL - 2023 IS - 16/5775 SP - 1 EP - 12 ER - TY - JOUR A1 - Marx, Jan A1 - Seefeldt, Malte A1 - Haske, Damian A1 - Lutz, Christian A1 - Hellmann, Ralf A1 - Esen, Cemal A1 - Ostendorf, Andreas T1 - Holographic freeform micro hole processing using Bessel beams JF - Optics & Laser Technology N2 - Bessel beams are advantageous tools for micro drilling applications due to their diffraction-free properties, their long focal length, and their small focal spot diameter. However, their application in industry is limited because they are challenging to integrate into flexible beam shaping systems. This work is intended to overcome limitations in flexibility by presenting a new approach paving the way to high-aspect ratio freeform holes. Therefore, a spatial light modulator was integrated into an axicon-based setup to merge diffraction-free ablation with the flexibility of holographic spatial beam shaping. A dynamic change of the phase hologram displayed on the spatial light modulator during the process allows for the generation of arbitrary ablation geometries. In contrast to other holographic approaches, the diffraction-free nature of the Bessel beam allows ablation over an extended focal depth without any focus control needed. The applicability of the approach was demonstrated by processing arbitrary hole shapes, such as ellipses, squares, or star-shapes. The hole sizes of the freeform holes range from 4 μm to 80 μm. Furthermore, up-scaling of the process is demonstrated by using the setup for generation of multi-Bessel spots. KW - Mikrobearbeitung KW - Laserbohren Y1 - 2025 U6 - https://doi.org/10.1016/j.optlastec.2024.112287 SN - 0030-3992 VL - 183 PB - Elsevier BV ER - TY - CHAP A1 - Franz, Daniel A1 - Mücke, Dominik A1 - Kunz, Tim A1 - Rung, Stefan A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - UV picosecond laser drilling of ABF film material for printed circuit boards using laser burst mode and beam shaping T2 - International Congress on Applications of Lasers & Electro-Optics (ICALEO) 2023 N2 - We report on an experimental study of laser microvia percussion drilling of Ajinomoto build-up film (ABF) material using an ultrashort pulsed laser in the ultraviolet region. In order to optimize the drilling quality in terms of the fabricated taper and microvia diameter, the MHz burst mode is used in combination with both a Gaussian and a top-hat laser intensity distribution. To evaluate the influence of the top-hat beam shape on defocusing, microvias were drilled at different z-positions in the range of 200 μm evenly distributed around the focal plane. The drilling quality was evaluated by laser scanning microscopy and metallography. When using a top-hat beam shape, a reduced taper of down to 26.8 % on average is achieved compared to a Gaussian beam. For the application of 3 intra-burst pulses, we find an improvement of the taper by 11.6% compared to the single pulse mode due to the increasing heat accumulation. Using a top-hat beam shape in combination with the MHz burst mode, an 18.2 % reduction in laser drilling time for a microvia with a similar taper is remarkable, demonstrating the high potential for scaling throughput in electronics manufacturing. KW - Pikosekundenbereich KW - Laserbohren Y1 - 2023 ER - TY - JOUR A1 - Franz, Daniel A1 - Schuster, David A1 - Schwarz, Simon A1 - Rung, Stefan A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Fabrication and analysis of through-glass vias for glass-based electronic packaging using an ultrashort pulsed laser JF - Optics and Lasers in Engineering KW - Ultrakurzzeitlaser KW - Laserbohren Y1 - 2025 U6 - https://doi.org/10.1016/j.optlaseng.2025.109106 SN - 0143-8166 VL - 193 PB - Elsevier BV ER - TY - CHAP A1 - Franz, Daniel A1 - Schuster, David A1 - Schwarz, Simon A1 - Rung, Stefan A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Ultrashort pulsed laser drilling of through-glass vias for glass core packaging T2 - Proceedings of LAMP2025 – the 9th International Congress on Laser Advanced Materials Processing, Ise-City, Japan, June 2025 KW - Ultrakurzzeitlaser KW - Laserbohren Y1 - 2025 ER -