TY - JOUR A1 - Bischoff, Kay A1 - Mücke, Dominik A1 - Roth, Gian-Luca A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - UV-Femtosecond-Laser Structuring of Cyclic Olefin Copolymer JF - Polymers N2 - We report on the laser ablation of cyclic olefin copolymer using an amplified ultrashort pulsed laser in the ultraviolet spectral range. In addition to a high ablation depth per laser-structured layer up to 74 μm at a fluence of 22 J cm−2, an excellent mean roughness 𝑅𝑎 of laser-patterned surfaces down to 0.5 μm is demonstrated. Furthermore, with increasing fluence, increasing ablation efficiencies up to 2.5 mm3 W−1 min−1 are determined. Regarding the quality of the ablation, we observed steep ablation flanks and low debris formation, though for fluences above 10.5 J cm−2 the formation of troughs was observed, being attributed to multiple reflections on the ablation flanks. For comparison, laser ablation was performed under identical conditions with an infrared laser wavelength. The results highlight that UV ablation exhibits significant advantages in terms of ablation efficiency, surface roughness and quality. Moreover, our results show that a larger UV focus spot accelerates the ablation process with comparable quality, paving the way for high-power UV ultrashort pulsed lasers towards an efficient and qualitative tool for the laser machining of cyclic olefin copolymer. The production of complex microfluidics further underlines the suitability of this type of laser. KW - Femtosekundenlaser Y1 - 2022 U6 - https://doi.org/https://doi.org/10.3390/polym14142962 VL - 14 IS - 14 SP - 2962 EP - 2962 ER - TY - CHAP A1 - Franz, Daniel A1 - Mücke, Dominik A1 - Kunz, Tim A1 - Rung, Stefan A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - UV picosecond laser drilling of ABF film material for printed circuit boards using laser burst mode and beam shaping T2 - International Congress on Applications of Lasers & Electro-Optics (ICALEO) 2023 N2 - We report on an experimental study of laser microvia percussion drilling of Ajinomoto build-up film (ABF) material using an ultrashort pulsed laser in the ultraviolet region. In order to optimize the drilling quality in terms of the fabricated taper and microvia diameter, the MHz burst mode is used in combination with both a Gaussian and a top-hat laser intensity distribution. To evaluate the influence of the top-hat beam shape on defocusing, microvias were drilled at different z-positions in the range of 200 μm evenly distributed around the focal plane. The drilling quality was evaluated by laser scanning microscopy and metallography. When using a top-hat beam shape, a reduced taper of down to 26.8 % on average is achieved compared to a Gaussian beam. For the application of 3 intra-burst pulses, we find an improvement of the taper by 11.6% compared to the single pulse mode due to the increasing heat accumulation. Using a top-hat beam shape in combination with the MHz burst mode, an 18.2 % reduction in laser drilling time for a microvia with a similar taper is remarkable, demonstrating the high potential for scaling throughput in electronics manufacturing. KW - Pikosekundenbereich KW - Laserbohren Y1 - 2023 ER - TY - CHAP A1 - Bischoff, Kay A1 - Mücke, Dominik A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - UV-Femtosecond-Laser Structuring of Silicon Carbide T2 - International Congress on Applications of Lasers & Electro-Optics (ICALEO) 2023 N2 - We report on ultraviolet ultrashort pulsed laser processing of silicon carbide. Laser ablated cavities are evaluated with respect to their ablation rates, surface roughness and overall quality by varying the laser pulse fluence. Using this type of laser, high edge quality and surface roughness down to 107 nm can be achieved with an ablation efficiency of up to 0.228 mm 3 W −1 min −1. Functional surfaces are produced by generating laser induced periodic surface structures. The comparison with infrared wavelength underlines the advantages of the ultraviolet wavelength for laser micro machining this material. Significant differences with respect to the measured ablation depths and roughness as well as generated micro-and nanostructures appear. While infrared ablation is dominated by a chipping mechanism above a critical fluence of 9.93 Jcm −2 , higher ablation rates are observed with strong quality losses at the same time. In comparison to the infrared emission wavelength, in general , a significantly higher processing quality is achieved with the ultraviolet emission wavelength. In addition, the influence of spot size and repetition rate in UV processing is investigated. By increasing these parameters, a process acceleration without quality losses is enabled. The generation of a sophisticated microstructure exemplifies the advantages of processing silicon carbide with the UV laser reported here. KW - Femtosekundenlaser KW - Siliciumcarbid Y1 - 2023 ER -