TY - JOUR A1 - Bischoff, Kay A1 - Mücke, Dominik A1 - Schubert, Andreas A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Rheological Investigation of Highly Filled Copper(II) Oxide Nanosuspensions to Optimize Precursor Particle Content in Reductive Laser-Sintering JF - Liquids N2 - In this article, the particle concentration of finely dispersed copper(II) oxide nanosuspensions as precursors for reductive laser sintering (RLS) is optimized on the basis of rheological investigations. For this metallization process, a smooth, homogeneous and defect-free precursor layer is a prerequisite for adherent and reproducible copper structures. The knowledge of the rheological properties of an ink is crucial for the selection of a suitable coating technology as well as for the adjustment of the ink formulation. Different dilutions of the nanosuspension were examined for their rheological behavior by recording flow curves. A strong shear thinning behavior was found and the viscosity decreases exponentially with increasing dilution. The viscoelastic behavior was investigated by a simulated doctor blade coating process using three-interval thixotropy tests. An overshoot in viscosity is observed, which decreases with increasing thinning of the precursor. As a comparison to these results, doctor blade coating of planar glass and polymer substrates was performed to prepare precursor layers for reductive laser sintering. Surface morphology measurements of the resulting coatings using laser scanning microscopy and rheological tests show that homogeneous precursor layers with constant thickness can be produced at a particle–solvent ratio of 1.33. A too-high particle content results in an irregular coating layer with deep grooves and a peak-to-valley height Sz of up to 7.8 μm. Precise dilution control allows the fabrication of smooth surfaces with a Sz down to 1.5 μm. KW - Laserstrahlsintern Y1 - 2024 U6 - https://doi.org/http://dx.doi.org/10.3390/liquids4020019 SN - 2673-8015 VL - 4 IS - 2 SP - 382 EP - 392 PB - MDPI AG ER - TY - JOUR A1 - Bischoff, Kay A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Femtosecond reductive Laser Sintering under multiple focus conditions for rapid production of conductive copper layers JF - Procedia CIRP KW - Femtosekundenlaser KW - Laserstrahlsintern Y1 - 2024 U6 - https://doi.org/http://dx.doi.org/10.1016/j.procir.2024.08.189 SN - 2212-8271 VL - 124 SP - 629 EP - 633 PB - Elsevier BV ER - TY - JOUR A1 - Sommer, David A1 - Hornung, Simon A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Surface roughness optimization of hybrid PBF-LB/M-built Inconel 718 using in situ high-speed milling JF - The International Journal of Advanced Manufacturing Technology N2 - AbstractWe report on the optimization of the surface roughness of hybrid additive manufactured Ni superalloys, combining a conventional laser powder bed fusion process with in situ high-speed milling. This remarkable hybrid approach has only recently been applied to different steel types and barely to Ni superalloys which opposite to steel appear to be challenging for milling processes, particularly within the powderbed of laser powder bed fusion. Different influencing factors on the surface roughness are varied in this study, following the Taguchi method. Their effect is evaluated with respect to the average surface roughness and the maximum surface roughness. The signal-to-noise ratio for the varied parameters infeed, z-pitch, feed rate, and spindle speed is calculated, determining their relevance on the surface roughness, and defining an optimal parameter combination. As the surface quality is optimized to $$\varvec{R_a=0.47\, \mu m}$$ R a = 0.47 μ m , the definition of the optimal parameter combination is of the highest relevance for the application of this novel manufacturing approach for Inconel. Using linear regression, the resulting surface roughness of these parameters is predicted, getting validated by the experimental evaluation. Due to a further analysis, including EDX analysis and a quantitative element analysis at different positions of the flank of the milling cutter, wear characteristics as well as the dissipation of the coating of the milling cutter are detected. The flank wear and the resulting breakage of the cutting edge are defined as the main reasons of a rising surface roughness. KW - Hybrid additive manufacturing KW - High-speed Milling KW - Taguchi-Method KW - Hochgeschwindigkeitsfräsen Y1 - 2024 U6 - https://doi.org/http://dx.doi.org/10.1007/s00170-024-13382-5 SN - 0268-3768 VL - 132 IS - 3-4 SP - 1741 EP - 1751 PB - Springer Science and Business Media LLC ER - TY - CHAP A1 - Sommer, David A1 - Hornung, Simon A1 - Esen, Cemal A1 - Hellmann, Ralf ED - Gu, Bo ED - Chen, Hongqiang T1 - Optimization of mechanical properties of additive manufactured IN 718 parts combining LPBF and in-situ high-speed milling T2 - Laser 3D Manufacturing XI KW - Hybrid additive manufacturing KW - High-speed Milling KW - Hot isostatic pressing KW - Fatigue behaviour KW - Hochgeschwindigkeitsfräsen Y1 - 2024 U6 - https://doi.org/http://dx.doi.org/10.1117/12.3000952 PB - SPIE ER - TY - CHAP A1 - Sommer, David A1 - Safi, Abdulrahman A1 - Esen, Cemal A1 - Hellmann, Ralf ED - Gu, Bo ED - Chen, Hongqiang T1 - Additive manufacturing of Nickel-based superalloy: optimization of surface roughness using integrated high-speed milling T2 - Laser 3D Manufacturing XI KW - Hochgeschwindigkeitsfräsen Y1 - 2024 U6 - https://doi.org/http://dx.doi.org/10.1117/12.3000972 PB - SPIE ER - TY - CHAP A1 - Lutz, Christian A1 - Sommerhuber, Ryan A1 - Kettner, Matthias A1 - Esen, Cemal A1 - Hellmann, Ralf ED - Kling, Rainer ED - Pfleging, Wilhelm ED - Sugioka, Koji T1 - Towards process control by detecting acoustic emissions during ultrashort pulsed laser ablation of multilayer materials T2 - Laser-based Micro- and Nanoprocessing XVIII N2 - We report on process sensing using a membrane-free optical microphone to monitor the acoustic emission during ultrashort pulsed laser ablation of multilayer materials. The acoustic emission during ablation is used to detect material transitions, with the specific signatures allowing to create a reliable process control for identifying individual layers. The outstanding properties of membrane-free optical microphones in terms of high bandwidth and high temporal resolution are ideally qualified for characterizing an ultrashort pulsed laser process, with its properties and capabilities being presented in this contribution. In particular, for layer- and material-selective ablation of multilayer printed circuit board components, copper and polyimide layers are ablated and the material transition is detected by analyzing the acoustic signal at different frequency levels, which is a novelty in the field of ultrashort pulsed laser process sensing. The investigations show, that the optical microphone can be used to resolve both the scanning paths and ablated layers by means of interruptions in a time-resolved acoustic spectrogram. Furthermore, as a result of a higher ablation rate of polyimide compared to copper and thus the increase of the emitted acoustic energy, the material transition between copper and polyimide layers can clearly be detected. The detection of this process event can be used for process control. KW - Ultrakurzzeitlaser Y1 - 2024 U6 - https://doi.org/10.1117/12.3000954 PB - SPIE ER - TY - CHAP A1 - Lutz, Christian A1 - Helm, Jonas A1 - Esen, Cemal A1 - Hellmann, Ralf ED - Kling, Rainer ED - Pfleging, Wilhelm ED - Sugioka, Koji T1 - Computational optimization of borehole sequences for the reduction of heat accumulation in drilling processes using ultrashort pulse lasers T2 - Laser-based Micro- and Nanoprocessing XVIII N2 - We report on laser drilling of borehole arrays using a high-power ultrashort pulse laser with particular focus on reducing heat accumulation in the workpiece by optimizing the drilling sequence, particularly for highly efficient multi-spot drilling. Different optimization approaches are chosen to improve the drilling sequence, also comparing a simplex algorithm and an evolutionary algorithm. From a laser application point of view, we also compare drilling sequences using a single spot and up to 16-fold multi-spots generated by a spatial light modulator, as to accelerate the drilling process in terms of the number of drilled holes per second. To evaluate the temperatures generated during drilling of up to 40,000 holes in less than 76 seconds in stainless steel foil, temperatures are measured by a thermal imaging camera and subsequently compared to a COMSOL-based simulation for all optimized drilling sequences. With respect to an average temperature of 706 °C without optimization, a reduction by 252 °C, i.e., a reduction by nearly 36 % based on the Celsius scale, is achieved using a 4 × 4 beam splitter and an optimized drilling sequence with a drilling rate of 526 holes per second. In addition, using a 2 × 2 beam splitter, a temperature reduction of up to 40.5 % is achieved for a drilling process with a rate of 129 holes per second using an optimized drilling sequence. KW - Ultrakurzzeitlaser Y1 - 2024 U6 - https://doi.org/10.1117/12.3000930 PB - SPIE ER - TY - JOUR A1 - Yang, Yongting A1 - Bischoff, Kay A1 - Mücke, Dominik A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - UV-ultrashort pulsed laser ablation of fused silica JF - Journal of Laser Applications N2 - The authors report on ultraviolet ultrashort pulsed laser ablation of fused silica and compare the achievable micromachining results to those obtained by using the fundamental emission wavelength in infrared. Ablation in ultraviolet reveals a stable efficiency for increasing fluences, whereas using an infrared beam exhibits a decreasing trend of the ablation efficiency at higher and increasing fluences. In addition, a significant improvement in the surface quality is found by using an ultraviolet wavelength in a fluence range up to 20 J/cm2 compared to infrared, e.g., revealing an Ra of down to 0.45 μm on using the ultraviolet wavelength compared to Ra = 0.56 μm on using infrared at fluences up 15 J/cm2. Moreover, taking advantage of the high available pulse energy, the authors compare the achievable ablation efficiency and surface roughness using a conventionally focused ultraviolet beam and a defocused ultraviolet beam, finding that the defocused ultraviolet beam possesses a processing quality comparable to that of the focused beam. Finally, the authors exemplify the potential of ultraviolet ultrashort pulsed laser ablation by using a Tesla mixer for microfluidic integration of fused silica. KW - Laserablation KW - Quarzglas KW - Laserbestrahlung Y1 - 2024 U6 - https://doi.org/http://dx.doi.org/10.2351/7.0001197 SN - 1042-346X VL - 36 IS - 1 PB - Laser Institute of America ER - TY - CHAP A1 - Lutz, Christian A1 - Schwarz, Simon A1 - Marx, Jan A1 - Esen, Cemal A1 - Hellmann, Ralf ED - Kling, Rainer ED - Pfleging, Wilhelm ED - Sugioka, Koji T1 - Combination of an axicon and a spatial light modulator for the generation of multiBessel beams for microdrilling using ultrashort pulsed laser T2 - Laser-based Micro- and Nanoprocessing XVIII N2 - Due to their special beam profile, Bessel beams offer advantageous properties for micro-drilling and internal volume processing, especially for transparent materials. In addition, the laser power of industrial ultrashort pulsed lasers hasnincreased significantly in recent years, offering the possibility of highly efficient processes using multi-spot profiles. We report on optical simulations and an experimental optical setup for generating multi-Bessel beams by combining a refractive axicon and a spatial light modulator. This setup offers a new possibility of multi-Bessel beam generation by functional division of the Bessel beam generation by the axicon and the possibility of separation flexible beam splitting by a spatial light modulator. The beam profiles generated with this setup are analyzed and compared in this study using optical simulations and experiments. In addition to the analysis of the Bessel beams in the machining plane, they are also analyzed in the propagation direction by means of intensity distributions measured by a camera in small-step z positions. Furthermore, the experimental applicability of the module-based beam shaping system is demonstrated by integrating into an existing laser system. KW - Ultrakurzzeitlaser Y1 - 2024 U6 - https://doi.org/10.1117/12.3000946 PB - SPIE ER - TY - CHAP A1 - Bischoff, Kay A1 - Kefer, Stefan A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Towards entirely ultrashort pulsed laser based process chain to manufacture polymer lab-on-chip systems with electrical, photonic, and microfluidic functionalities T2 - The 5th Smart Laser Processing Conference (SLPC) KW - Ultrakurzzeitlaser Y1 - 2024 UR - https://confit.atlas.jp/guide/event/opic2024/subject/SLPCp-22/date?cryptoId=&lo=fin&eventCode=opic2024 ER -