TY - JOUR A1 - Lutz, Christian A1 - Helm, Jonas A1 - Tschirpke, Katrin A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Drilling Sequence Optimization Using Evolutionary Algorithms to Reduce Heat Accumulation for Femtosecond Laser Drilling with Multi-Spot Beam Profiles JF - MDPI Materials N2 - We report on laser drilling borehole arrays using ultrashort pulsed lasers with a particular focus on reducing the inadvertent heat accumulation across the workpiece by optimizing the drilling sequence. For the optimization, evolutionary algorithms are used and their results are verified by thermal simulation using Comsol and experimentally evaluated using a thermal imaging camera. To enhance process efficiency in terms of boreholes drilled per second, multi-spot approaches are employed using a spatial light modulator. However, as higher temperatures occur across the workpiece when using simultaneous multi-spot drilling as compared to a single-spot process, a subtle spatial distribution and sequence of the multi-spot approach has to be selected in order to limit the resulting local heat input over the processing time. Different optimization approaches based on evolutionary algorithms aid to select those drilling sequences which allow for the combination of a high efficiency of multi-spot profiles, a low-generated process temperature and a high-component quality. In particular, using a 4 x 4 laser spot array allows for the drilling of 40,000 boreholes in less than 76 s (526 boreholes/s) with a reduced temperature increase by about 35%, as compared to a single spot process when employing an optimized drilling sequence. KW - USP laser processing KW - Laser drilling KW - Optimization of heat accumulation KW - Evolutionary Algorithms KW - Thermal simualtions KW - Laserbohren KW - Ultrakurzzeitlaser Y1 - 2023 UR - https://www.mdpi.com/1996-1944/16/17/5775 U6 - https://doi.org/10.3390/ma16175775 VL - 2023 IS - 16/5775 SP - 1 EP - 12 ER - TY - JOUR A1 - Lutz, Christian A1 - Schwarz, Simon A1 - Marx, Jan A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Multi-Bessel Beams Generated by an Axicon and a Spatial Light Modulator for Drilling Applications JF - MDPI Photonics N2 - We report on an optical setup to generate multi-Bessel beam profiles combining a refractive axicon and a spatial light modulator. Based on their particular beam profile, Bessel beams offer advantageous properties for micro drilling processes and internal volume processing, especially for transparent materials. In addition, the laser power of industrial, ultrashort pulsed lasers has increased significantly over the last few years, offering the possibility for highly efficient processes using multi-spot profiles. Our optical concept combines the dynamic possibilities of beam splitting using a spatial light modulator with the benefits of Bessel beams, which facilitates multi-Bessel beam processing. Beside the simulation and experimental evaluation of the generated multi-Bessel beams, we exemplify the applicability of the developed module for the perforation of thin metal foils by micro drilling. KW - Bessel beam KW - Axicon KW - Optical System KW - Ultrashort pulsed laser KW - Material ablation KW - Bessel-Bündel KW - Ultrakurzzeitlaser Y1 - 2023 UR - https://www.mdpi.com/2304-6732/10/4/413 U6 - https://doi.org/10.3390/photonics10040413 VL - 2023 IS - 10/413 SP - 1 EP - 9 ER - TY - JOUR A1 - Häfner, Tom A1 - Bischoff, Kay A1 - Helm, Jonas A1 - Kunz, Tim A1 - Rung, Stefan A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Picosecond laser microvia drilling of ABF material using MHz burst mode JF - Materials Research Express N2 - We report on a comprehensive study of laser percussion microvia drilling of Ajinomoto build-up film (ABF) material using an ultrashort pulsed laser in MHz burst mode. After laser processing, microvia drilling quality is being evaluated by the fabricated diameter and taper using laser scanning microscopy and metallography. The influences of the incubation effect, heat accumulation and shielding effects as a result of pulse to pulse interactions are being discussed on the ablation threshold, penetration depth and laser microvia drilling quality. We find that an increasing heat accumulation in MHz burst mode processing is responsible for the void formation and delamination of the insulating ABF layer. Therefore, the parameter clearance is introduced to evaluate these effects on the microvia sidewalls. For a comparable clearance, applying 2 intra-burst pulses achieves an average reduced taper of down to 19.5% compared to single pulse mode. At the same time, a reduced laser drilling time of 16.7% per microvia highlights the enormous potential of the MHz burst mode for laser drilling of ABF material in printed circuit board fabrication. KW - Ultrakurzzeitlaser KW - Pikosekundenbereich Y1 - 2023 VL - 10 IS - 9 SP - 096301 EP - 096311 ER - TY - JOUR A1 - Zettl, Julian A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Fundamental Considerations and Analysis of the Energy Distribution in Laser Turning with Ultrashort Laser Pulses JF - mdpi Micromachines N2 - This article discusses the process of the laser turning of rotational symmetric, cylindrical components using ultrashort laser pulses with respect to the geometrical conditions and the resulting energy distribution during the laser turning process. As a result, process predictions and potential process optimizations are feasible. Particular attention is drawn to the laser spot formation on the cylindrical surface of the work piece in conjunction with the positioning of the laser beam relative to the rotation axis of the specimen. Based on fundamental calculations and experimental results, an optimum processing strategy is discussed, whereat the use of a trepanning optic in the laser turning process and the forming of a particular surface structure is additionally being issued. KW - ultrashort pulse laser KW - laser turning KW - tangential processing KW - trepanning optic KW - Ultrakurzzeitlaser Y1 - 2023 UR - https://www.mdpi.com/2072-666X/14/10/1838 U6 - https://doi.org/10.3390/mi14101838 VL - 14 IS - 10 SP - 1 EP - 15 ER - TY - JOUR A1 - Franz, Daniel A1 - Yang, Yongting A1 - Michel, Luis A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - Evaluation of an ultrashort pulsed laser robot system for flexible and large-area micromachining JF - Journal of Laser Applications N2 - We report for the first time on the realization, characterization and application of an ultrashort pulsed laser robot system for flexible and large-area 2D and 3D laser micromachining with 6 articulated axes. To characterize the dynamic positioning of the laser beam during and after axes movement, CMOS image sensors were integrated into the beam path. A method introduced for the alignment of the optical axes allows a reduction of the deviations in laser beam positioning to less than 141.8 ± 92.9 μm within a 110° rotation range of axis 4. In addition, a high laser beam positioning repeatability of less than 102.2 μm is demonstrated over a total period of 14 h for a movement of axis 5 within a range of 0° to 90°. Initial laser cutting, laser structuring and laser marking applications on automotive dashboards and glass substrates are presented for flexible and large area 2D and 3D manufacturing. By applying a special laser cutting strategy for processing AF 32 eco thin glass, high cutting quality is achieved with a taper of up to 96.3% without the generation of cracks, demonstrating the innovative potential of the high-precision laser robot system. Nonetheless, different identified inherent influences of each axis 1–5 during robot axis movement demand for an innovative beam stabilization concept to achieve high precision in laser beam positioning. KW - Ultrakurzzeitlaser KW - Industrieroboter Y1 - 2023 N1 - Proceedings of the International Congress of Applications of Lasers & Electro-Optics (ICALEO 2023) VL - 35 IS - 4 SP - 042057 EP - 042065 ER -