TY - JOUR A1 - Roth, Gian-Luca A1 - Adelmann, Benedikt A1 - Hellmann, Ralf T1 - Cutting and Drilling of SiC Semiconductor by Fiber Laser JF - Journal of Laser Micro/Nanoengineering N2 - We present an experimental study on fiber laser micromachining of 4H-SiC semiconductor. In particular, we optimize the process time for percussion drilling of 440 µm and 330 µm thick wafers with a minimum drilling time of, eg, 7.5 ms being achieved for 330 µm thick wafers. The drilled holes are characterized by a low taper, a high circularity and entry diameters of about 60 µm. For laser cutting, effective cutting speeds of 2 mm/s and 0.63 mm/s are obtained for 330 µm and 440 µm wafer thickness, respectively, with the cut kerf width being 65 µm. Both processes are associated with a good quality that is characterized by no chipping and cracks. The capability of the fiber laser based micromachining process is highlighted by cutting complex micrometer scale inner and outer contours into partially metallized SiC wafers with high quality. KW - Laserschneiden KW - Faserlaser Y1 - 2015 VL - 10 IS - 3 SP - 279 EP - 283 ER - TY - JOUR A1 - Adelmann, Benedikt A1 - Hellmann, Ralf T1 - Rapid micro hole laser drilling in ceramic substrates using single mode fiber laser JF - Journal of Materials Processing Technology KW - Laserbohren KW - Faserlaser Y1 - 2015 VL - 2015 IS - 221 SP - 80 EP - 86 ER - TY - CHAP A1 - Adelmann, Benedikt A1 - Neumeier, Benedikt A1 - Schleier, Max A1 - Wilmann, Eugen A1 - Hellmann, Ralf T1 - Optical cutting tear detection system for industrial fiber laser based cutting machines T2 - Lasers in Manufacturing Conference 2015 KW - Laserschneiden KW - Faserlaser Y1 - 2015 ER - TY - CHAP A1 - Adelmann, Benedikt A1 - Hellmann, Ralf T1 - Comparative study of experimentally determined and simulated mechanical strength of fiber laser cut alumina substrates T2 - Proceedings of the 7th International Congress on Laser Advanced Materials Processing KW - Laserschneiden KW - Faserlaser KW - Aluminiumoxide Y1 - 2015 VL - 2015 IS - 15 SP - 1 EP - 9 ER - TY - JOUR A1 - Adelmann, Benedikt A1 - Roth, Gian-Luca A1 - Hellmann, Ralf T1 - Back side ablation of SiC diodes using a q-switched NIR laser JF - Journal of Laser Micro/Nanoengineering KW - Halbleiterdiode KW - NIR Y1 - 2015 VL - 10 SP - 190 EP - 194 ER - TY - JOUR A1 - Adelmann, Benedikt A1 - Schleier, Max A1 - Neumeier, Benedikt A1 - Wilmann, Eugen A1 - Hellmann, Ralf T1 - Optical cutting interruption sensor for fiber lasers JF - Applied Sciences KW - Laserschneiden KW - Faserlaser Y1 - 2015 VL - 2015 IS - 5/3 SP - 544 EP - 554 ER - TY - JOUR A1 - Adelmann, Benedikt A1 - Ngo, Chan A1 - Hellmann, Ralf T1 - High aspect ratio cutting of metals using water jet guided laser JF - The International Journal of Advanced Manufacturing Technology KW - Laserschneiden KW - Wasserstrahlschneiden Y1 - 2015 VL - 2015 IS - 80 SP - 2053 EP - 2060 ER -