TY - JOUR A1 - Fuchs, Christopher A1 - Schreck, Timo A1 - Kaloudis, Michael T1 - Metallographische Untersuchungen an Sn-8Zn-3Bi-Lötverbindungen JF - PLUS KW - Lötverbindung KW - Metallographie Y1 - 2011 VL - 13 IS - 10 SP - 2378 EP - 2384 ER - TY - JOUR A1 - Wohlschlögel, Timo A1 - Kaloudis, Michael T1 - Praktische Oberflächenanalytik – Überblick über die Verfahren EDX, AES, XPS und SIMS JF - Galvanotechnik KW - Oberflächenanalyse Y1 - 2011 IS - 12 SP - 2637 EP - 2646 ER - TY - JOUR A1 - Fuchs, Christopher A1 - Schreck, Timo A1 - Kaloudis, Michael T1 - Interfacial reactions between Sn 57Bi 1Ag solder and electroless Ni-P/immersion Au under solid-state aging JF - Journal of Materials Science KW - interfacial reactions KW - Intermetallische Verbindungen Y1 - 2014 VL - 47 IS - 9 SP - 4036 EP - 4041 ER - TY - JOUR A1 - Heininger, Patrick A1 - Schreck, Timo A1 - Kaloudis, Michael T1 - Buckelschweißen zur zuverlässigen Kontaktierung von Industrieakkumulatoren JF - PLUS 14 KW - Buckelschweißen KW - Buckelschweißen KW - Akkumulator Y1 - 2012 IS - 5 SP - 1163 EP - 1169 ER - TY - JOUR A1 - Sahl, Martin A1 - Kaloudis, Michael T1 - Einsatz von Glasloten zur Erzeugung gasdichter Fügestellen beim Aufbau von Drucksensoren JF - PLUS KW - Drucksensor KW - Glaslot Y1 - 2010 IS - 12 SP - 1367 PB - Leuze-Verlag CY - Bad Saulgau ER - TY - JOUR A1 - Rauer, Miriam A1 - Volkert, Antje A1 - Härter, Stefan A1 - Schreck, Timo A1 - Kaloudis, Michael ED - Stevenson, Michael T1 - Computed-Tomography-Based Analysis of Voids in SnBi57Ag1 Solder Joints and Their Influence on the Reliability JF - Journal of Failure Analysis and Prevention KW - Computertomographie KW - Löten Y1 - 2014 VL - 14 IS - 3 SP - 272 EP - 281 ER - TY - JOUR A1 - Braunwarth, Louisa A1 - Amrhein, Sebastian A1 - Schreck, Timo A1 - Kaloudis, Michael ED - Huisingh, Donald T1 - Ecological comparison of soldering and sintering as die-attach technologies in power electronics JF - Journal of Cleaner Production N2 - In this study the method of life cycle assessment is used to perform a comparison of two die-attach technologies of power modules: silver sintering and common soldering with a tin–silver–copper solder. The goal of the study is to indicate which die-attach technique is more environmentally friendly. This is important in order to design future electronics more environmentally friendly. Processing covers the manufacturing of the respective pastes, application of pastes, and mounting as well as the subsequent sintering or soldering, including cleaning of the soldered parts. The last step in the processing is a wire bonding process. The environmental impacts are expressed in CO2-equivalents and ReCiPe points and different variants are discussed: comparisons are made between considered pastes and between a soldered and a sintered power module, including consideration of lifetime. Concerning sintering, the influence of using recycled silver is analyzed more closely. The types of stages included in this life cycle assessment best fit a cradle-to-gate assessment, because usage, recycling, and disposal are not included. The software used is OpenLCA version 1.3.3, created by GreenDelta, and the database used is Ecoinvent version 2.2. In order to fill data gaps, electronics manufacturing companies were contacted, and our own calculations and measurements were applied. The consideration of the wet film thicknesses of the soldering system and sintering system, respectively, results in very similar CO2-equivalent emissions for sinter paste and solder paste. Comparing the soldered power module to the sintered one shows minor to significant differences between the two systems which could easily be changed when changing circumstances and assumptions. But when considering the respective lifetimes of the joining technologies, sintering technology is clearly preferable to the conventional soldering technology. Using solely recycled silver for manufacturing of silver sinter paste reduces the CO2-equivalent emissions of one sintered power module by roughly 40%. The results clearly show the dependence of outcomes on the initial settings. Consideration of lifetime has an enormous impact on the comparison of soldering technology to sintering technology. But the benefit of this life extension through the use of sintering technology is only useful when a long lifetime is required. KW - Life cycle assessment; Solder; Sinter; Die-attach; Power electronics; Environment KW - Löten KW - Sintern KW - Leistungselektronik Y1 - 2015 VL - 23 IS - 102 SP - 408 EP - 417 ER - TY - JOUR A1 - Rauer, Miriam A1 - Kaloudis, Michael T1 - Ausfallanalyse an einem Lithium-Ionen Akkumulator JF - Maschinenmarkt KW - Lithium-Ionen-Akkumulator Y1 - 2014 VL - 2014 IS - 2 SP - 45 EP - 46 ER - TY - JOUR A1 - Rauer, Miriam A1 - Kaloudis, Michael T1 - Computertomographie erweitert das Blickfeld JF - Mikroproduktion KW - Computertomographie Y1 - 2014 VL - 2014 IS - 1 SP - 50 EP - 51 ER - TY - JOUR A1 - Dressler, Katharina A1 - Rauer, Miriam A1 - Kaloudis, Michael A1 - Dauwe, Stefan A1 - Herguth, Axel A1 - Hahn, Giso T1 - Nondestructive Characterization of Voids in Rear Local Contacts of PERC-Type Solar Cells JF - IEEE Journal of Photovoltaics N2 - In this paper, we present two nondestructive characterization methods for the detection of voids in rear local contacts of passivated emitter and rear-type solar cells, namely scanning acoustic microscopy and computer tomography. We compare both methods and include a comparison with electroluminescence measurements. It is shown in this paper that voids can easily be detected with both measurement types without any sample preparation. We found a good match of scanning acoustic microscopy (SAM) and computer tomography (CT), which is presented for this purpose for the first time. The investigation was carried out for different aluminum pastes. KW - Solarzelle Y1 - 2014 U6 - https://doi.org/10.1109/JPHOTOV.2014.2359745 VL - 2015 IS - 1 SP - 70 EP - 76 ER - TY - CHAP A1 - Rauer, Miriam A1 - Schreck, Timo A1 - Härter, Stefan A1 - Kaloudis, Michael T1 - The Effect of Thermal Stress on the Reliability of low Ag Solder Joints in High Power LEDs T2 - 20th European Microelectronics and Packaging Conference (EMPC) & Exhibition, 14.-16.09.2015 KW - Lumineszenzdiode KW - Thermische Belastung KW - Zuverlässigkeit KW - Lötverbindung Y1 - 2015 SP - 1 EP - 6 ER - TY - CHAP A1 - Rauer, Miriam A1 - Xu, Ping A1 - Reinhardt, Andreas A1 - Kaloudis, Michael A1 - Franke, Jörg T1 - Einfluss von Poren in Lötverbindungen bei LED-Anwendungen T2 - Elektronische Baugruppen und Leiterplatten – EBL 2016 KW - Lötverbindung KW - Lumineszenzdiode KW - Pore Y1 - 2016 SN - 978-3-8007-4147-2 SP - 135 EP - 139 PB - VDE Verlag CY - Berlin ER - TY - JOUR A1 - Amrhein, Sebastian A1 - Schneider, Mareike A1 - Kaloudis, Michael T1 - Ein zweites Leben für den Akku JF - ReSource KW - Lithium-Ionen-Akkumulator KW - Elektrofahrrad Y1 - 2016 VL - 2016 IS - 1 SP - 10 EP - 16 ER - TY - JOUR A1 - Bachmann, Marco A1 - Amrhein, Sebastian A1 - Kaloudis, Michael T1 - Intelligente Pedelecs fördern. Ein Ansatz zur nachhaltigen Verbesserung unseres Mobilitätsverhaltens JF - Internationales Verkehrswesen KW - Pedelec Y1 - 2016 VL - 2016 IS - 1 SP - 16 EP - 19 ER - TY - CHAP A1 - Schwarzer, Christian A1 - Chew, Ly May A1 - Schnepf, Michael A1 - Stoll, Thomas A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - INVESTIGATION OF COPPER SINTER MATERIAL FOR DIE ATTACH T2 - SMTA International Conference Proceedings KW - Leistungshalbleiter KW - Leistungselektronik KW - Kupfer KW - Sintern Y1 - 2018 VL - 2018 IS - Proceedings SMTAI 2018 CY - Rosemont ER - TY - CHAP A1 - Hensel, Alexander A1 - Schwarzer, Christian A1 - Scheetz, Matthias A1 - Kaloudis, Michael A1 - Franke, Jörg T1 - Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations T2 - 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) KW - Leistungselektronik KW - Hochtemperatur KW - Sintern Y1 - 2018 U6 - https://doi.org/10.1109/EPTC.2018.8654421 VL - 2018 SP - 416 EP - 421 CY - Singapore ER - TY - CHAP A1 - Schmitt, Wolfgang A1 - Schnepf, Michael A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - Investigation of a Sintering Process for Micro-Scale Copper Material T2 - 2019 SMTA Electronic in Harsh Environments Conference KW - Kupfer KW - Sintern Y1 - 2019 VL - 2019 ER - TY - CHAP A1 - Stenzel, David A1 - Schwarzer, Christian A1 - Schnepf, Michael A1 - Schmitt, Wolfgang A1 - Blank, Thomas A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - Characterization of Alternative Sinter Materials for Power Electronics T2 - 22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy KW - Sintern, Silber, Kupfer KW - Leistungselektronik KW - Sintern Y1 - 2019 ER - TY - CHAP A1 - Hensel, Alexander A1 - Roth, Frederick A1 - Merz, Corinna A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates in High Temperature Applications T2 - 22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy KW - 3D, KW - Kupfer KW - Sintern KW - Silbersintern KW - Sintern KW - Hochtemperatur Y1 - 2019 ER - TY - JOUR A1 - Amrhein, Frank A1 - Kehrer, Martin A1 - Schreck, Timo A1 - Bochtler, Ulrich A1 - Hellmann, Ralf A1 - Kaloudis, Michael T1 - UV-LED-Bestrahlung von Vergussmaterial: Schnelle Aushärtung auch im Schatten JF - adhäsion KLEBEN & DICHTEN KW - Lumineszenzdiode Y1 - 2011 IS - 5 SP - 38 EP - 41 ER -