TY - CHAP A1 - Rauer, Miriam A1 - Xu, Ping A1 - Reinhardt, Andreas A1 - Kaloudis, Michael A1 - Franke, Jörg T1 - Einfluss von Poren in Lötverbindungen bei LED-Anwendungen T2 - Elektronische Baugruppen und Leiterplatten – EBL 2016 KW - Lötverbindung KW - Lumineszenzdiode KW - Pore Y1 - 2016 SN - 978-3-8007-4147-2 SP - 135 EP - 139 PB - VDE Verlag CY - Berlin ER - TY - JOUR A1 - Sahl, Martin A1 - Kaloudis, Michael T1 - Einsatz von Glasloten zur Erzeugung gasdichter Fügestellen beim Aufbau von Drucksensoren JF - PLUS KW - Drucksensor KW - Glaslot Y1 - 2010 IS - 12 SP - 1367 PB - Leuze-Verlag CY - Bad Saulgau ER - TY - JOUR A1 - Rauer, Miriam A1 - Kaloudis, Michael T1 - Hinter der Fassade - Ausfallanalyse an einem Lithium-Ionen Akkumulator mittels CT JF - QZ Qualität und Zuverlässigkeit KW - Ausfallanalyse KW - Lithium-Ionen-Akkumulator KW - Ausfallanalyse Y1 - 2013 VL - 2013 IS - 1 SP - 40 EP - 41 ER - TY - CHAP A1 - Sauer, Theresia A1 - Kefer, Stefan A1 - Ruppert, Wolfgang A1 - Hellmann, Ralf A1 - Kaloudis, Michael T1 - Integration of Bragg grating sensors in components made of carbon fiber reinforced polymers T2 - Tagungsband der 20. GMA/ITG-Fachtagung Sensoren und Messsysteme 2019, 25.06.2019 - 26.06.2019, Nürnberg, Deutschland N2 - This contribution discusses the integration of polymer planar Bragg grating sensors (PPBG) into carbon fiber reinforced polymer (CFRP) components. For the first time, it is shown that PPBGs based on cyclic olefin copolymers can be integrated into commercial-grade composites, thereby withstanding the demanding production processes. Pre-impregnated fibers are stacked and partially modified to form a sensor pocket. Afterwards, the CFRP specimen containing the optical sensor is cured in a heated mechanical press for 2 hours at a pressure of 7 bar and a temperature of 120 °C. A subsequent evalutaion of the sensor signal shows a Bragg wavelength shift of 1236 pm and a decline in signal amplitude of -2 dB. Three-point flexural tests of the cured sample reveal a linear behavior of the sensor signal towards external loads. The determined sensitivity in dependence of the CFRP specimen's maximum central deflection is -112 pm/mm, while correlation to the applied force results in a sensitivity of -5 pm/N. KW - Bragg grating sensors KW - carbon fiber reinforced polymers KW - cyclic olefin copolymers KW - structural health monitoring KW - Bragg-Reflektor Y1 - 2019 SN - 978-3-9819376-0-2 U6 - https://doi.org/10.5162/sensoren2019/P3.12 SP - 806 EP - 810 ER - TY - JOUR A1 - Bachmann, Marco A1 - Amrhein, Sebastian A1 - Kaloudis, Michael T1 - Intelligente Pedelecs fördern. Ein Ansatz zur nachhaltigen Verbesserung unseres Mobilitätsverhaltens JF - Internationales Verkehrswesen KW - Pedelec Y1 - 2016 VL - 2016 IS - 1 SP - 16 EP - 19 ER - TY - JOUR A1 - Fuchs, Christopher A1 - Schreck, Timo A1 - Kaloudis, Michael T1 - Interfacial reactions between Sn 57Bi 1Ag solder and electroless Ni-P/immersion Au under solid-state aging JF - Journal of Materials Science KW - interfacial reactions KW - Intermetallische Verbindungen Y1 - 2014 VL - 47 IS - 9 SP - 4036 EP - 4041 ER - TY - CHAP A1 - Schmitt, Wolfgang A1 - Schnepf, Michael A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - Investigation of a Sintering Process for Micro-Scale Copper Material T2 - 2019 SMTA Electronic in Harsh Environments Conference KW - Kupfer KW - Sintern Y1 - 2019 VL - 2019 ER - TY - CHAP A1 - Schwarzer, Christian A1 - Chew, Ly May A1 - Schnepf, Michael A1 - Stoll, Thomas A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - INVESTIGATION OF COPPER SINTER MATERIAL FOR DIE ATTACH T2 - SMTA International Conference Proceedings KW - Leistungshalbleiter KW - Leistungselektronik KW - Kupfer KW - Sintern Y1 - 2018 VL - 2018 IS - Proceedings SMTAI 2018 CY - Rosemont ER - TY - CHAP A1 - Hensel, Alexander A1 - Roth, Frederick A1 - Merz, Corinna A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates in High Temperature Applications T2 - 22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy KW - 3D, KW - Kupfer KW - Sintern KW - Silbersintern KW - Sintern KW - Hochtemperatur Y1 - 2019 ER - TY - CHAP A1 - Hensel, Alexander A1 - Schwarzer, Christian A1 - Scheetz, Matthias A1 - Kaloudis, Michael A1 - Franke, Jörg T1 - Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations T2 - 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) KW - Leistungselektronik KW - Hochtemperatur KW - Sintern Y1 - 2018 U6 - https://doi.org/10.1109/EPTC.2018.8654421 VL - 2018 SP - 416 EP - 421 CY - Singapore ER -