TY - JOUR A1 - Schreck, Timo A1 - Schnorpfeil, Anna A1 - Kaloudis, Michael T1 - Analysing the growth of intermetallic compounds in lead-free solder joints by differential scanning calorimetry measurements JF - Journal of Materials Science KW - intermetallic compounds KW - Differential scanning calorimetry KW - Lötverbindung Y1 - 2013 U6 - https://doi.org/10.1007/s10853-012-7035-5 VL - 48(2013) IS - 6 SP - 2476 EP - 2484 ER - TY - JOUR A1 - Rauer, Miriam A1 - Kaloudis, Michael T1 - Ausfallanalyse an einem Lithium-Ionen Akkumulator JF - Maschinenmarkt KW - Lithium-Ionen-Akkumulator Y1 - 2014 VL - 2014 IS - 2 SP - 45 EP - 46 ER - TY - JOUR A1 - Heininger, Patrick A1 - Schreck, Timo A1 - Kaloudis, Michael T1 - Buckelschweißen zur zuverlässigen Kontaktierung von Industrieakkumulatoren JF - PLUS 14 KW - Buckelschweißen KW - Buckelschweißen KW - Akkumulator Y1 - 2012 IS - 5 SP - 1163 EP - 1169 ER - TY - CHAP A1 - Stenzel, David A1 - Schwarzer, Christian A1 - Schnepf, Michael A1 - Schmitt, Wolfgang A1 - Blank, Thomas A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - Characterization of Alternative Sinter Materials for Power Electronics T2 - 22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy KW - Sintern, Silber, Kupfer KW - Leistungselektronik KW - Sintern Y1 - 2019 ER - TY - JOUR A1 - Rauer, Miriam A1 - Volkert, Antje A1 - Härter, Stefan A1 - Schreck, Timo A1 - Kaloudis, Michael ED - Stevenson, Michael T1 - Computed-Tomography-Based Analysis of Voids in SnBi57Ag1 Solder Joints and Their Influence on the Reliability JF - Journal of Failure Analysis and Prevention KW - Computertomographie KW - Löten Y1 - 2014 VL - 14 IS - 3 SP - 272 EP - 281 ER - TY - JOUR A1 - Rauer, Miriam A1 - Kaloudis, Michael T1 - Computertomographie erweitert das Blickfeld JF - Mikroproduktion KW - Computertomographie Y1 - 2014 VL - 2014 IS - 1 SP - 50 EP - 51 ER - TY - CHAP A1 - Kaloumenos, Mareiki A1 - Amrhein, Frank A1 - Glaab, Johannes A1 - Sauer, Michael A1 - Hellmann, Ralf A1 - Kaloudis, Michael T1 - Development of a UV-Light Source with Highest Power Density Based on Light Emitting Diode Technology for Applications in Production Engineering, in Production Engineering and manufacturing Systems T2 - Proceedings of the XXIV International Scientific Conference Miskolc, Ungarn KW - Lumineszenzdiode Y1 - 2010 ER - TY - JOUR A1 - Braunwarth, Louisa A1 - Amrhein, Sebastian A1 - Schreck, Timo A1 - Kaloudis, Michael ED - Huisingh, Donald T1 - Ecological comparison of soldering and sintering as die-attach technologies in power electronics JF - Journal of Cleaner Production N2 - In this study the method of life cycle assessment is used to perform a comparison of two die-attach technologies of power modules: silver sintering and common soldering with a tin–silver–copper solder. The goal of the study is to indicate which die-attach technique is more environmentally friendly. This is important in order to design future electronics more environmentally friendly. Processing covers the manufacturing of the respective pastes, application of pastes, and mounting as well as the subsequent sintering or soldering, including cleaning of the soldered parts. The last step in the processing is a wire bonding process. The environmental impacts are expressed in CO2-equivalents and ReCiPe points and different variants are discussed: comparisons are made between considered pastes and between a soldered and a sintered power module, including consideration of lifetime. Concerning sintering, the influence of using recycled silver is analyzed more closely. The types of stages included in this life cycle assessment best fit a cradle-to-gate assessment, because usage, recycling, and disposal are not included. The software used is OpenLCA version 1.3.3, created by GreenDelta, and the database used is Ecoinvent version 2.2. In order to fill data gaps, electronics manufacturing companies were contacted, and our own calculations and measurements were applied. The consideration of the wet film thicknesses of the soldering system and sintering system, respectively, results in very similar CO2-equivalent emissions for sinter paste and solder paste. Comparing the soldered power module to the sintered one shows minor to significant differences between the two systems which could easily be changed when changing circumstances and assumptions. But when considering the respective lifetimes of the joining technologies, sintering technology is clearly preferable to the conventional soldering technology. Using solely recycled silver for manufacturing of silver sinter paste reduces the CO2-equivalent emissions of one sintered power module by roughly 40%. The results clearly show the dependence of outcomes on the initial settings. Consideration of lifetime has an enormous impact on the comparison of soldering technology to sintering technology. But the benefit of this life extension through the use of sintering technology is only useful when a long lifetime is required. KW - Life cycle assessment; Solder; Sinter; Die-attach; Power electronics; Environment KW - Löten KW - Sintern KW - Leistungselektronik Y1 - 2015 VL - 23 IS - 102 SP - 408 EP - 417 ER - TY - JOUR A1 - Schneider, Johannes A1 - Bochtler, Ulrich A1 - Hellmann, Ralf A1 - Kaloudis, Michael A1 - Gockel, Tilo T1 - Effiziente Entwärmung eines Hochleistungs-UV-LED-Moduls JF - Elektor, Sonderheft LEDs 3 KW - Lumineszenzdiode Y1 - 2011 VL - 2011 IS - 9 SP - 12 EP - 17 ER - TY - JOUR A1 - Amrhein, Sebastian A1 - Schneider, Mareike A1 - Kaloudis, Michael T1 - Ein zweites Leben für den Akku JF - ReSource KW - Lithium-Ionen-Akkumulator KW - Elektrofahrrad Y1 - 2016 VL - 2016 IS - 1 SP - 10 EP - 16 ER -