TY - CHAP A1 - Rauer, Miriam A1 - Schreck, Timo A1 - Härter, Stefan A1 - Kaloudis, Michael T1 - The Effect of Thermal Stress on the Reliability of low Ag Solder Joints in High Power LEDs T2 - 20th European Microelectronics and Packaging Conference (EMPC) & Exhibition, 14.-16.09.2015 KW - Lumineszenzdiode KW - Thermische Belastung KW - Zuverlässigkeit KW - Lötverbindung Y1 - 2015 SP - 1 EP - 6 ER - TY - CHAP A1 - Rauer, Miriam A1 - Xu, Ping A1 - Reinhardt, Andreas A1 - Kaloudis, Michael A1 - Franke, Jörg T1 - Einfluss von Poren in Lötverbindungen bei LED-Anwendungen T2 - Elektronische Baugruppen und Leiterplatten – EBL 2016 KW - Lötverbindung KW - Lumineszenzdiode KW - Pore Y1 - 2016 SN - 978-3-8007-4147-2 SP - 135 EP - 139 PB - VDE Verlag CY - Berlin ER - TY - JOUR A1 - Amrhein, Sebastian A1 - Schneider, Mareike A1 - Kaloudis, Michael T1 - Ein zweites Leben für den Akku JF - ReSource KW - Lithium-Ionen-Akkumulator KW - Elektrofahrrad Y1 - 2016 VL - 2016 IS - 1 SP - 10 EP - 16 ER - TY - JOUR A1 - Bachmann, Marco A1 - Amrhein, Sebastian A1 - Kaloudis, Michael T1 - Intelligente Pedelecs fördern. Ein Ansatz zur nachhaltigen Verbesserung unseres Mobilitätsverhaltens JF - Internationales Verkehrswesen KW - Pedelec Y1 - 2016 VL - 2016 IS - 1 SP - 16 EP - 19 ER - TY - CHAP A1 - Schwarzer, Christian A1 - Chew, Ly May A1 - Schnepf, Michael A1 - Stoll, Thomas A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - INVESTIGATION OF COPPER SINTER MATERIAL FOR DIE ATTACH T2 - SMTA International Conference Proceedings KW - Leistungshalbleiter KW - Leistungselektronik KW - Kupfer KW - Sintern Y1 - 2018 VL - 2018 IS - Proceedings SMTAI 2018 CY - Rosemont ER - TY - CHAP A1 - Hensel, Alexander A1 - Schwarzer, Christian A1 - Scheetz, Matthias A1 - Kaloudis, Michael A1 - Franke, Jörg T1 - Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations T2 - 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) KW - Leistungselektronik KW - Hochtemperatur KW - Sintern Y1 - 2018 U6 - https://doi.org/10.1109/EPTC.2018.8654421 VL - 2018 SP - 416 EP - 421 CY - Singapore ER - TY - CHAP A1 - Schmitt, Wolfgang A1 - Schnepf, Michael A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - Investigation of a Sintering Process for Micro-Scale Copper Material T2 - 2019 SMTA Electronic in Harsh Environments Conference KW - Kupfer KW - Sintern Y1 - 2019 VL - 2019 ER - TY - CHAP A1 - Stenzel, David A1 - Schwarzer, Christian A1 - Schnepf, Michael A1 - Schmitt, Wolfgang A1 - Blank, Thomas A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - Characterization of Alternative Sinter Materials for Power Electronics T2 - 22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy KW - Sintern, Silber, Kupfer KW - Leistungselektronik KW - Sintern Y1 - 2019 ER - TY - CHAP A1 - Hensel, Alexander A1 - Roth, Frederick A1 - Merz, Corinna A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates in High Temperature Applications T2 - 22nd Microelectronics and Packaging Conference (EMPC) & Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy KW - 3D, KW - Kupfer KW - Sintern KW - Silbersintern KW - Sintern KW - Hochtemperatur Y1 - 2019 ER - TY - JOUR A1 - Amrhein, Frank A1 - Kehrer, Martin A1 - Schreck, Timo A1 - Bochtler, Ulrich A1 - Hellmann, Ralf A1 - Kaloudis, Michael T1 - UV-LED-Bestrahlung von Vergussmaterial: Schnelle Aushärtung auch im Schatten JF - adhäsion KLEBEN & DICHTEN KW - Lumineszenzdiode Y1 - 2011 IS - 5 SP - 38 EP - 41 ER -