<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>629</id>
    <completedYear>2014</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst>272</pageFirst>
    <pageLast>281</pageLast>
    <pageNumber/>
    <edition/>
    <issue>3</issue>
    <volume>14</volume>
    <type>article</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2014-03-15</completedDate>
    <publishedDate>2014-03-15</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="deu">Computed-Tomography-Based Analysis of Voids in SnBi57Ag1 Solder Joints and Their Influence on the Reliability</title>
    <parentTitle language="eng">Journal of Failure Analysis and Prevention</parentTitle>
    <enrichment key="copyright">0</enrichment>
    <licence>Keine Lizenz - es gilt das deutsche Urheberrecht</licence>
    <author>Miriam Rauer</author>
    <editor>Michael Stevenson</editor>
    <author>Antje Volkert</author>
    <author>Stefan Härter</author>
    <author>Timo Schreck</author>
    <author>Michael Kaloudis</author>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Computertomographie</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Löten</value>
    </subject>
    <collection role="forschungsschwerpunkte" number="">Electronics and Electric Drives</collection>
    <collection role="forschungsschwerpunkte" number="">Intelligent Sensors and Signals</collection>
    <collection role="forschungsschwerpunkte" number="">Clean Tech</collection>
    <collection role="forschungsschwerpunkte" number="">Material Testing &amp; Sensor Technology</collection>
  </doc>
</export-example>
