<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>2004</id>
    <completedYear>2022</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>deu</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>doctoralthesis</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2022-02-23</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>2022-02-15</thesisDateAccepted>
    <title language="deu">Kupfersintern als Fügetechnologie für Leistungselektronik</title>
    <enrichment key="Vertraege">OPUS-Veröffentlichungen</enrichment>
    <enrichment key="copyright">1</enrichment>
    <enrichment key="opus.source">publish</enrichment>
    <licence>Keine Lizenz - es gilt das deutsche Urheberrecht</licence>
    <author>Christian Schwarzer</author>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Leistungshalbleiter</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Leistungselektronik</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Sintern</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Kupfer</value>
    </subject>
    <collection role="institutes" number="">Aufbau- und Verbindungstechnik</collection>
    <collection role="forschungsschwerpunkte" number="">Material Testing &amp; Sensor Technology</collection>
    <thesisPublisher>Technische Hochschule Aschaffenburg</thesisPublisher>
    <thesisGrantor>Friedrich-Alexander-Universität Erlangen-Nürnberg</thesisGrantor>
  </doc>
  <doc>
    <id>1398</id>
    <completedYear>2018</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue>Proceedings SMTAI 2018</issue>
    <volume>2018</volume>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace>Rosemont</publisherPlace>
    <creatingCorporation>SMTA</creatingCorporation>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2019-12-04</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">INVESTIGATION OF COPPER SINTER MATERIAL FOR DIE ATTACH</title>
    <parentTitle language="eng">SMTA International Conference Proceedings</parentTitle>
    <enrichment key="copyright">1</enrichment>
    <licence>Keine Lizenz - es gilt das deutsche Urheberrecht</licence>
    <author>Christian Schwarzer</author>
    <author>Ly May Chew</author>
    <author>Michael Schnepf</author>
    <author>Thomas Stoll</author>
    <author>Jörg Franke</author>
    <author>Michael Kaloudis</author>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Leistungshalbleiter</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Leistungselektronik</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Kupfer</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Sintern</value>
    </subject>
    <collection role="forschungsschwerpunkte" number="">Electronics and Electric Drives</collection>
    <collection role="forschungsschwerpunkte" number="">Clean Tech</collection>
    <collection role="forschungsschwerpunkte" number="">Material Testing &amp; Sensor Technology</collection>
  </doc>
</export-example>
