<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>1402</id>
    <completedYear>2019</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume>2019</volume>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2019-04-04</completedDate>
    <publishedDate>2019-04-04</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Investigation of a Sintering Process for Micro-Scale Copper Material</title>
    <parentTitle language="eng">2019 SMTA Electronic in Harsh Environments Conference</parentTitle>
    <enrichment key="copyright">1</enrichment>
    <licence>Keine Lizenz - es gilt das deutsche Urheberrecht</licence>
    <author>Wolfgang Schmitt</author>
    <author>Michael Schnepf</author>
    <author>Jörg Franke</author>
    <author>Michael Kaloudis</author>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Kupfer</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Sintern</value>
    </subject>
    <collection role="forschungsschwerpunkte" number="">Electronics and Electric Drives</collection>
    <collection role="forschungsschwerpunkte" number="">Clean Tech</collection>
    <collection role="forschungsschwerpunkte" number="">Material Testing &amp; Sensor Technology</collection>
  </doc>
  <doc>
    <id>1403</id>
    <completedYear>2019</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2019-09-18</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Characterization of Alternative Sinter Materials for Power Electronics</title>
    <parentTitle language="eng">22nd Microelectronics and Packaging Conference (EMPC) &amp; Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy</parentTitle>
    <enrichment key="copyright">1</enrichment>
    <licence>Keine Lizenz - es gilt das deutsche Urheberrecht</licence>
    <author>David Stenzel</author>
    <author>Christian Schwarzer</author>
    <author>Michael Schnepf</author>
    <author>Wolfgang Schmitt</author>
    <author>Thomas Blank</author>
    <author>Jörg Franke</author>
    <author>Michael Kaloudis</author>
    <subject>
      <language>deu</language>
      <type>uncontrolled</type>
      <value>Sintern, Silber, Kupfer</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Leistungselektronik</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Sintern</value>
    </subject>
    <collection role="forschungsschwerpunkte" number="">Electronics and Electric Drives</collection>
    <collection role="forschungsschwerpunkte" number="">Clean Tech</collection>
    <collection role="forschungsschwerpunkte" number="">Material Testing &amp; Sensor Technology</collection>
  </doc>
</export-example>
