<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>716</id>
    <completedYear>2015</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1</pageFirst>
    <pageLast>6</pageLast>
    <pageNumber>6</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2016-03-10</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">The Effect of Thermal Stress on the Reliability of low Ag Solder Joints in High Power LEDs</title>
    <parentTitle language="eng">20th European Microelectronics and Packaging Conference (EMPC) &amp; Exhibition, 14.-16.09.2015</parentTitle>
    <enrichment key="copyright">1</enrichment>
    <licence>Keine Lizenz - es gilt das deutsche Urheberrecht</licence>
    <author>Miriam Rauer</author>
    <author>Timo Schreck</author>
    <author>Stefan Härter</author>
    <author>Michael Kaloudis</author>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Lumineszenzdiode</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Thermische Belastung</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Zuverlässigkeit</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Lötverbindung</value>
    </subject>
    <collection role="forschungsschwerpunkte" number="">Electronics and Electric Drives</collection>
    <collection role="forschungsschwerpunkte" number="">Clean Tech</collection>
    <collection role="forschungsschwerpunkte" number="">Material Testing &amp; Sensor Technology</collection>
  </doc>
</export-example>
