<?xml version="1.0" encoding="utf-8"?>
<export-example>
  <doc>
    <id>1399</id>
    <completedYear>2018</completedYear>
    <publishedYear/>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>416</pageFirst>
    <pageLast>421</pageLast>
    <pageNumber/>
    <edition/>
    <issue/>
    <volume>2018</volume>
    <type>conferenceobject</type>
    <publisherName/>
    <publisherPlace>Singapore</publisherPlace>
    <creatingCorporation/>
    <contributingCorporation>IEEE</contributingCorporation>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2019-12-04</completedDate>
    <publishedDate>2018-12-07</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations</title>
    <parentTitle language="eng">2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)</parentTitle>
    <identifier type="doi">10.1109/EPTC.2018.8654421</identifier>
    <enrichment key="copyright">1</enrichment>
    <licence>Keine Lizenz - es gilt das deutsche Urheberrecht</licence>
    <author>Alexander Hensel</author>
    <author>Christian Schwarzer</author>
    <author>Matthias Scheetz</author>
    <author>Michael Kaloudis</author>
    <author>Jörg Franke</author>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Leistungselektronik</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Hochtemperatur</value>
    </subject>
    <subject>
      <language>deu</language>
      <type>swd</type>
      <value>Sintern</value>
    </subject>
    <collection role="forschungsschwerpunkte" number="">Electronics and Electric Drives</collection>
    <collection role="forschungsschwerpunkte" number="">Clean Tech</collection>
    <collection role="forschungsschwerpunkte" number="">Material Testing &amp; Sensor Technology</collection>
  </doc>
</export-example>
