@article{RauerVolkertHaerteretal.2014, author = {Rauer, Miriam and Volkert, Antje and H{\"a}rter, Stefan and Schreck, Timo and Kaloudis, Michael}, title = {Computed-Tomography-Based Analysis of Voids in SnBi57Ag1 Solder Joints and Their Influence on the Reliability}, series = {Journal of Failure Analysis and Prevention}, volume = {14}, journal = {Journal of Failure Analysis and Prevention}, number = {3}, editor = {Stevenson, Michael}, pages = {272 -- 281}, year = {2014}, subject = {Computertomographie}, language = {de} } @inproceedings{RauerSchreckHaerteretal.2015, author = {Rauer, Miriam and Schreck, Timo and H{\"a}rter, Stefan and Kaloudis, Michael}, title = {The Effect of Thermal Stress on the Reliability of low Ag Solder Joints in High Power LEDs}, series = {20th European Microelectronics and Packaging Conference (EMPC) \& Exhibition, 14.-16.09.2015}, booktitle = {20th European Microelectronics and Packaging Conference (EMPC) \& Exhibition, 14.-16.09.2015}, pages = {1 -- 6}, year = {2015}, subject = {Lumineszenzdiode}, language = {en} }