@inproceedings{SchwarzerChewSchnepfetal.2018, author = {Schwarzer, Christian and Chew, Ly May and Schnepf, Michael and Stoll, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {INVESTIGATION OF COPPER SINTER MATERIAL FOR DIE ATTACH}, series = {SMTA International Conference Proceedings}, volume = {2018}, booktitle = {SMTA International Conference Proceedings}, number = {Proceedings SMTAI 2018}, address = {Rosemont}, organization = {SMTA}, year = {2018}, subject = {Leistungshalbleiter}, language = {en} } @inproceedings{SchmittSchnepfFrankeetal.2019, author = {Schmitt, Wolfgang and Schnepf, Michael and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Investigation of a Sintering Process for Micro-Scale Copper Material}, series = {2019 SMTA Electronic in Harsh Environments Conference}, volume = {2019}, booktitle = {2019 SMTA Electronic in Harsh Environments Conference}, year = {2019}, subject = {Kupfer}, language = {en} } @inproceedings{HenselRothMerzetal.2019, author = {Hensel, Alexander and Roth, Frederick and Merz, Corinna and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates in High Temperature Applications}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Sintern}, language = {en} }