@inproceedings{HenselRothMerzetal.2019, author = {Hensel, Alexander and Roth, Frederick and Merz, Corinna and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates in High Temperature Applications}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Sintern}, language = {en} }