@inproceedings{SchwarzerChewSchnepfetal.2018, author = {Schwarzer, Christian and Chew, Ly May and Schnepf, Michael and Stoll, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {INVESTIGATION OF COPPER SINTER MATERIAL FOR DIE ATTACH}, series = {SMTA International Conference Proceedings}, volume = {2018}, booktitle = {SMTA International Conference Proceedings}, number = {Proceedings SMTAI 2018}, address = {Rosemont}, organization = {SMTA}, year = {2018}, subject = {Leistungshalbleiter}, language = {en} } @inproceedings{HenselSchwarzerScheetzetal.2018, author = {Hensel, Alexander and Schwarzer, Christian and Scheetz, Matthias and Kaloudis, Michael and Franke, J{\"o}rg}, title = {Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations}, series = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, volume = {2018}, booktitle = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, address = {Singapore}, doi = {10.1109/EPTC.2018.8654421}, pages = {416 -- 421}, year = {2018}, subject = {Leistungselektronik}, language = {en} } @inproceedings{Schwarzer2019, author = {Schwarzer, Christian}, title = {Zuverl{\"a}ssigkeit von L{\"o}tverbindungen in Abh{\"a}ngigkeit von ihrem Porenanteil}, series = {22. Europ{\"a}isches Elektroniktechnologie-Kolleg 27.-31. M{\"a}rz 2019 Colonia de Sant Jordi, Mallorca}, booktitle = {22. Europ{\"a}isches Elektroniktechnologie-Kolleg 27.-31. M{\"a}rz 2019 Colonia de Sant Jordi, Mallorca}, year = {2019}, subject = {L{\"o}tverbindung}, language = {de} } @inproceedings{StenzelSchwarzerSchnepfetal.2019, author = {Stenzel, David and Schwarzer, Christian and Schnepf, Michael and Schmitt, Wolfgang and Blank, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Characterization of Alternative Sinter Materials for Power Electronics}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Leistungselektronik}, language = {en} } @phdthesis{Schwarzer2022, author = {Schwarzer, Christian}, title = {Kupfersintern als F{\"u}getechnologie f{\"u}r Leistungselektronik}, school = {Technische Hochschule Aschaffenburg}, year = {2022}, subject = {Leistungshalbleiter}, language = {de} }