@inproceedings{AdelmannNeumeierSchleieretal.2015, author = {Adelmann, Benedikt and Neumeier, Benedikt and Schleier, Max and Wilmann, Eugen and Hellmann, Ralf}, title = {Optical cutting tear detection system for industrial fiber laser based cutting machines}, series = {Lasers in Manufacturing Conference 2015}, booktitle = {Lasers in Manufacturing Conference 2015}, year = {2015}, subject = {Laserschneiden}, language = {en} } @article{AdelmannSchleierNeumeieretal.2015, author = {Adelmann, Benedikt and Schleier, Max and Neumeier, Benedikt and Wilmann, Eugen and Hellmann, Ralf}, title = {Optical cutting interruption sensor for fiber lasers}, series = {Applied Sciences}, volume = {2015}, journal = {Applied Sciences}, number = {5/3}, pages = {544 -- 554}, year = {2015}, subject = {Laserschneiden}, language = {en} } @article{SchleierAdelmannNeumeieretal.2017, author = {Schleier, Max and Adelmann, Benedikt and Neumeier, Benedikt and Hellmann, Ralf}, title = {Burr formation detector for fiber laser cutting based on a photodiode sensor system}, series = {Optics \& Laser Technology}, volume = {96}, journal = {Optics \& Laser Technology}, number = {-}, doi = {10.1016/j.optlastec.2017.04.027}, pages = {13 -- 17}, year = {2017}, subject = {Laserschneiden}, language = {en} } @article{AdelmannHellmann2013, author = {Adelmann, Benedikt and Hellmann, Ralf}, title = {Investigation on Flexural Strength during Fiber Laser Cutting of Alumina}, series = {Physics Procedia}, volume = {41}, journal = {Physics Procedia}, pages = {405 -- 407}, year = {2013}, subject = {Faserlaser}, language = {de} } @inproceedings{AdelmannHellmann2011, author = {Adelmann, Benedikt and Hellmann, Ralf}, title = {Different modulation schemes in fibre laser cutting}, series = {Proceeding XXV microCAD, International scientific conference, 2011, Section K: Material science/Material processing technologies}, booktitle = {Proceeding XXV microCAD, International scientific conference, 2011, Section K: Material science/Material processing technologies}, pages = {1 -- 6}, year = {2011}, subject = {Laserschneiden}, language = {en} } @inproceedings{AdelmannHellmann2011, author = {Adelmann, Benedikt and Hellmann, Ralf}, title = {DOE based optimization of fibre laser cutting of metals}, series = {Proceeding XXV microCAD, International scientific conference, 2011, Section K: Material science/Material processing technologies}, booktitle = {Proceeding XXV microCAD, International scientific conference, 2011, Section K: Material science/Material processing technologies}, pages = {7 -- 12}, year = {2011}, subject = {Laserschneiden}, language = {en} } @article{SchleierAdelmannEsenetal.2021, author = {Schleier, Max and Adelmann, Benedikt and Esen, Cemal and Glatzel, Uwe and Hellmann, Ralf}, title = {Development and evaluation of an image processing algorithm for monitoring fiber laser fusion cutting by a high-speed camera}, series = {Journal of Laser Applications}, volume = {2021}, journal = {Journal of Laser Applications}, number = {33}, doi = {10.2351/7.0000391}, pages = {032004 -- 032004}, year = {2021}, subject = {Faserlaser}, language = {en} } @article{RothAdelmannHellmann2015, author = {Roth, Gian-Luca and Adelmann, Benedikt and Hellmann, Ralf}, title = {Cutting and Drilling of SiC Semiconductor by Fiber Laser}, series = {Journal of Laser Micro/Nanoengineering}, volume = {10}, journal = {Journal of Laser Micro/Nanoengineering}, number = {3}, pages = {279 -- 283}, year = {2015}, abstract = {We present an experimental study on fiber laser micromachining of 4H-SiC semiconductor. In particular, we optimize the process time for percussion drilling of 440 µm and 330 µm thick wafers with a minimum drilling time of, eg, 7.5 ms being achieved for 330 µm thick wafers. The drilled holes are characterized by a low taper, a high circularity and entry diameters of about 60 µm. For laser cutting, effective cutting speeds of 2 mm/s and 0.63 mm/s are obtained for 330 µm and 440 µm wafer thickness, respectively, with the cut kerf width being 65 µm. Both processes are associated with a good quality that is characterized by no chipping and cracks. The capability of the fiber laser based micromachining process is highlighted by cutting complex micrometer scale inner and outer contours into partially metallized SiC wafers with high quality.}, subject = {Laserschneiden}, language = {en} } @article{AdelmannHellmann2017, author = {Adelmann, Benedikt and Hellmann, Ralf}, title = {A study of SiC decomposition under laser irradiation}, series = {Applied Physics A}, volume = {2017}, journal = {Applied Physics A}, number = {123}, pages = {454 -- 452}, year = {2017}, subject = {Laserbestrahlung}, language = {en} } @article{AdelmannHellmann2016, author = {Adelmann, Benedikt and Hellmann, Ralf}, title = {Numerical and experimental study on flexural strength of laser microstructured alumina}, series = {Advances in Ceramic Science and Engineering}, volume = {2016}, journal = {Advances in Ceramic Science and Engineering}, number = {5}, pages = {28 -- 34}, year = {2016}, subject = {Faserlaser}, language = {en} } @article{Adelmann2015, author = {Adelmann, Benedikt}, title = {Fiber laser cutting of aumina substrates for electronic applications - comparison of the experimentally determined and simulated influence on the mechanical strength}, series = {Journal of Electrical Engineering}, volume = {2015}, journal = {Journal of Electrical Engineering}, number = {3}, pages = {111 -- 119}, year = {2015}, subject = {Laserschneiden}, language = {en} } @inproceedings{AdelmannHellmann2015, author = {Adelmann, Benedikt and Hellmann, Ralf}, title = {Comparative study of experimentally determined and simulated mechanical strength of fiber laser cut alumina substrates}, series = {Proceedings of the 7th International Congress on Laser Advanced Materials Processing}, volume = {2015}, booktitle = {Proceedings of the 7th International Congress on Laser Advanced Materials Processing}, number = {15}, pages = {1 -- 9}, year = {2015}, subject = {Laserschneiden}, language = {en} } @inproceedings{Adelmann2015, author = {Adelmann, Benedikt}, title = {Substrate thinning of SiC semiconductor components using fiber laser}, series = {Proceedings of the 7th International Congress on Laser Advanced Materials Processing}, booktitle = {Proceedings of the 7th International Congress on Laser Advanced Materials Processing}, number = {15}, year = {2015}, subject = {Faserlaser}, language = {en} } @article{AdelmannHellmann2015, author = {Adelmann, Benedikt and Hellmann, Ralf}, title = {Rapid micro hole laser drilling in ceramic substrates using single mode fiber laser}, series = {Journal of Materials Processing Technology}, volume = {2015}, journal = {Journal of Materials Processing Technology}, number = {221}, pages = {80 -- 86}, year = {2015}, subject = {Laserbohren}, language = {en} }