@article{FuchsSchreckKaloudis2012, author = {Fuchs, Christopher and Schreck, Timo and Kaloudis, Michael}, title = {Interfacial reactions between Sn 57Bi 1Ag solder and electroless Ni-P/immersion Au under solid-state aging}, series = {Journal of Materials Science}, volume = {47}, journal = {Journal of Materials Science}, number = {9}, pages = {4036 -- 4041}, year = {2012}, subject = {Intermetallische Verbindungen}, language = {en} } @article{SchreckSchnorpfeilKaloudis2013, author = {Schreck, Timo and Schnorpfeil, Anna and Kaloudis, Michael}, title = {Analysing the growth of intermetallic compounds in lead-free solder joints by differential scanning calorimetry measurements}, series = {Journal of Materials Science}, volume = {48(2013)}, journal = {Journal of Materials Science}, number = {6}, doi = {10.1007/s10853-012-7035-5}, pages = {2476 -- 2484}, year = {2013}, subject = {Differential scanning calorimetry}, language = {en} } @article{AmrheinKehrerSchrecketal.2011, author = {Amrhein, Frank and Kehrer, Martin and Schreck, Timo and Bochtler, Ulrich and Hellmann, Ralf and Kaloudis, Michael}, title = {More efficient curing of UV sensitive mounting materials}, series = {Practical metallography}, volume = {48}, journal = {Practical metallography}, number = {7}, pages = {356 -- 364}, year = {2011}, subject = {Aush{\"a}rtung}, language = {en} } @inproceedings{KaloumenosAmrheinGlaabetal.2010, author = {Kaloumenos, Mareiki and Amrhein, Frank and Glaab, Johannes and Sauer, Michael and Hellmann, Ralf and Kaloudis, Michael}, title = {Development of a UV-Light Source with Highest Power Density Based on Light Emitting Diode Technology for Applications in Production Engineering, in Production Engineering and manufacturing Systems}, series = {Proceedings of the XXIV International Scientific Conference Miskolc, Ungarn}, booktitle = {Proceedings of the XXIV International Scientific Conference Miskolc, Ungarn}, year = {2010}, subject = {Lumineszenzdiode}, language = {en} } @article{RauerSchreckKaloudis2013, author = {Rauer, Miriam and Schreck, Timo and Kaloudis, Michael}, title = {X-Ray Computed Tomography as Supporting Technology in the Failure Analysis of Press-In Connections for Electronic Assemblies}, series = {Practical Metallography}, volume = {50(2013)}, journal = {Practical Metallography}, number = {3}, pages = {205 -- 221}, year = {2013}, subject = {Fehleranalyse}, language = {en} } @inproceedings{RauerSchreckHaerteretal.2015, author = {Rauer, Miriam and Schreck, Timo and H{\"a}rter, Stefan and Kaloudis, Michael}, title = {The Effect of Thermal Stress on the Reliability of low Ag Solder Joints in High Power LEDs}, series = {20th European Microelectronics and Packaging Conference (EMPC) \& Exhibition, 14.-16.09.2015}, booktitle = {20th European Microelectronics and Packaging Conference (EMPC) \& Exhibition, 14.-16.09.2015}, pages = {1 -- 6}, year = {2015}, subject = {Lumineszenzdiode}, language = {en} } @inproceedings{SchwarzerChewSchnepfetal.2018, author = {Schwarzer, Christian and Chew, Ly May and Schnepf, Michael and Stoll, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {INVESTIGATION OF COPPER SINTER MATERIAL FOR DIE ATTACH}, series = {SMTA International Conference Proceedings}, volume = {2018}, booktitle = {SMTA International Conference Proceedings}, number = {Proceedings SMTAI 2018}, address = {Rosemont}, organization = {SMTA}, year = {2018}, subject = {Leistungshalbleiter}, language = {en} } @inproceedings{HenselSchwarzerScheetzetal.2018, author = {Hensel, Alexander and Schwarzer, Christian and Scheetz, Matthias and Kaloudis, Michael and Franke, J{\"o}rg}, title = {Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations}, series = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, volume = {2018}, booktitle = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, address = {Singapore}, doi = {10.1109/EPTC.2018.8654421}, pages = {416 -- 421}, year = {2018}, subject = {Leistungselektronik}, language = {en} } @inproceedings{SchmittSchnepfFrankeetal.2019, author = {Schmitt, Wolfgang and Schnepf, Michael and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Investigation of a Sintering Process for Micro-Scale Copper Material}, series = {2019 SMTA Electronic in Harsh Environments Conference}, volume = {2019}, booktitle = {2019 SMTA Electronic in Harsh Environments Conference}, year = {2019}, subject = {Kupfer}, language = {en} } @inproceedings{StenzelSchwarzerSchnepfetal.2019, author = {Stenzel, David and Schwarzer, Christian and Schnepf, Michael and Schmitt, Wolfgang and Blank, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Characterization of Alternative Sinter Materials for Power Electronics}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Leistungselektronik}, language = {en} }