@article{FuchsSchreckKaloudis2012, author = {Fuchs, Christopher and Schreck, Timo and Kaloudis, Michael}, title = {Interfacial reactions between Sn 57Bi 1Ag solder and electroless Ni-P/immersion Au under solid-state aging}, series = {Journal of Materials Science}, volume = {47}, journal = {Journal of Materials Science}, number = {9}, pages = {4036 -- 4041}, year = {2012}, subject = {Intermetallische Verbindungen}, language = {en} } @inproceedings{RauerSchreckHaerteretal.2015, author = {Rauer, Miriam and Schreck, Timo and H{\"a}rter, Stefan and Kaloudis, Michael}, title = {The Effect of Thermal Stress on the Reliability of low Ag Solder Joints in High Power LEDs}, series = {20th European Microelectronics and Packaging Conference (EMPC) \& Exhibition, 14.-16.09.2015}, booktitle = {20th European Microelectronics and Packaging Conference (EMPC) \& Exhibition, 14.-16.09.2015}, pages = {1 -- 6}, year = {2015}, subject = {Lumineszenzdiode}, language = {en} } @inproceedings{SchwarzerChewSchnepfetal.2018, author = {Schwarzer, Christian and Chew, Ly May and Schnepf, Michael and Stoll, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {INVESTIGATION OF COPPER SINTER MATERIAL FOR DIE ATTACH}, series = {SMTA International Conference Proceedings}, volume = {2018}, booktitle = {SMTA International Conference Proceedings}, number = {Proceedings SMTAI 2018}, address = {Rosemont}, organization = {SMTA}, year = {2018}, subject = {Leistungshalbleiter}, language = {en} } @inproceedings{HenselSchwarzerScheetzetal.2018, author = {Hensel, Alexander and Schwarzer, Christian and Scheetz, Matthias and Kaloudis, Michael and Franke, J{\"o}rg}, title = {Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations}, series = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, volume = {2018}, booktitle = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, address = {Singapore}, doi = {10.1109/EPTC.2018.8654421}, pages = {416 -- 421}, year = {2018}, subject = {Leistungselektronik}, language = {en} } @inproceedings{SchmittSchnepfFrankeetal.2019, author = {Schmitt, Wolfgang and Schnepf, Michael and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Investigation of a Sintering Process for Micro-Scale Copper Material}, series = {2019 SMTA Electronic in Harsh Environments Conference}, volume = {2019}, booktitle = {2019 SMTA Electronic in Harsh Environments Conference}, year = {2019}, subject = {Kupfer}, language = {en} } @inproceedings{StenzelSchwarzerSchnepfetal.2019, author = {Stenzel, David and Schwarzer, Christian and Schnepf, Michael and Schmitt, Wolfgang and Blank, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Characterization of Alternative Sinter Materials for Power Electronics}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Leistungselektronik}, language = {en} } @inproceedings{HenselRothMerzetal.2019, author = {Hensel, Alexander and Roth, Frederick and Merz, Corinna and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates in High Temperature Applications}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Sintern}, language = {en} } @article{AmrheinKehrerSchrecketal.2011, author = {Amrhein, Frank and Kehrer, Martin and Schreck, Timo and Bochtler, Ulrich and Hellmann, Ralf and Kaloudis, Michael}, title = {More efficient curing of UV sensitive mounting materials}, series = {Practical metallography}, volume = {48}, journal = {Practical metallography}, number = {7}, pages = {356 -- 364}, year = {2011}, subject = {Aush{\"a}rtung}, language = {en} } @article{KeferSauerHessleretal.2020, author = {Kefer, Stefan and Sauer, Theresia and Hessler, Steffen and Kaloudis, Michael and Hellmann, Ralf}, title = {Microstructure-Based Fiber-to-Chip Coupling of Polymer Planar Bragg Gratings for Harsh Environment Applications}, series = {Sensors (Basel)}, volume = {20}, journal = {Sensors (Basel)}, number = {19}, doi = {10.3390/s20195452}, pages = {5452 -- 5452}, year = {2020}, abstract = {This article proposes and demonstrates a robust microstructure-based fiber-to-chip coupling scheme for planar Bragg grating devices. A polymer planar Bragg grating substrate is manufactured and microstructured by means of a micromilling process, while the respective photonic structures are generated by employing a sophisticated single-writing UV-exposure method. A stripped standard single mode fiber is inserted into the microstructure, which is filled with a UV-curable adhesive, and aligned with the integrated waveguide. After curing, final sensor assembly and thermal treatment, the proposed coupling scheme is capable of withstanding pressures up to 10 bar, at room temperature, and pressures up to 7.5 bar at an elevated temperature of 120 °C. Additionally, the coupling scheme is exceedingly robust towards tensile forces, limited only by the tensile strength of the employed single mode fiber. Due to its outstanding robustness, the coupling scheme enables the application of planar Bragg grating devices in harsh environments. This fact is underlined by integrating a microstructure-coupled photonic device into the center of a commercial-grade carbon fiber-reinforced polymer specimen. After its integration, the polymer-based Bragg grating sensor still exhibits a reflection peak with a dynamic range of 24 dB, and can thus be employed for sensing purposes.}, language = {en} } @inproceedings{KaloumenosAmrheinGlaabetal.2010, author = {Kaloumenos, Mareiki and Amrhein, Frank and Glaab, Johannes and Sauer, Michael and Hellmann, Ralf and Kaloudis, Michael}, title = {Development of a UV-Light Source with Highest Power Density Based on Light Emitting Diode Technology for Applications in Production Engineering, in Production Engineering and manufacturing Systems}, series = {Proceedings of the XXIV International Scientific Conference Miskolc, Ungarn}, booktitle = {Proceedings of the XXIV International Scientific Conference Miskolc, Ungarn}, year = {2010}, subject = {Lumineszenzdiode}, language = {en} }