@article{FuchsSchreckKaloudis2011, author = {Fuchs, Christopher and Schreck, Timo and Kaloudis, Michael}, title = {Metallographische Untersuchungen an Sn-8Zn-3Bi-L{\"o}tverbindungen}, series = {PLUS}, volume = {13}, journal = {PLUS}, number = {10}, pages = {2378 -- 2384}, year = {2011}, subject = {L{\"o}tverbindung}, language = {de} } @article{WohlschloegelKaloudis2011, author = {Wohlschl{\"o}gel, Timo and Kaloudis, Michael}, title = {Praktische Oberfl{\"a}chenanalytik - {\"U}berblick {\"u}ber die Verfahren EDX, AES, XPS und SIMS}, series = {Galvanotechnik}, journal = {Galvanotechnik}, number = {12}, pages = {2637 -- 2646}, year = {2011}, subject = {Oberfl{\"a}chenanalyse}, language = {de} } @article{FuchsSchreckKaloudis2012, author = {Fuchs, Christopher and Schreck, Timo and Kaloudis, Michael}, title = {Interfacial reactions between Sn 57Bi 1Ag solder and electroless Ni-P/immersion Au under solid-state aging}, series = {Journal of Materials Science}, volume = {47}, journal = {Journal of Materials Science}, number = {9}, pages = {4036 -- 4041}, year = {2012}, subject = {Intermetallische Verbindungen}, language = {en} } @article{HeiningerSchreckKaloudis2012, author = {Heininger, Patrick and Schreck, Timo and Kaloudis, Michael}, title = {Buckelschweißen zur zuverl{\"a}ssigen Kontaktierung von Industrieakkumulatoren}, series = {PLUS 14}, journal = {PLUS 14}, number = {5}, pages = {1163 -- 1169}, year = {2012}, subject = {Buckelschweißen}, language = {de} } @article{SahlKaloudis2010, author = {Sahl, Martin and Kaloudis, Michael}, title = {Einsatz von Glasloten zur Erzeugung gasdichter F{\"u}gestellen beim Aufbau von Drucksensoren}, series = {PLUS}, journal = {PLUS}, number = {12}, publisher = {Leuze-Verlag}, address = {Bad Saulgau}, pages = {1367}, year = {2010}, subject = {Drucksensor}, language = {de} } @article{RauerVolkertHaerteretal.2014, author = {Rauer, Miriam and Volkert, Antje and H{\"a}rter, Stefan and Schreck, Timo and Kaloudis, Michael}, title = {Computed-Tomography-Based Analysis of Voids in SnBi57Ag1 Solder Joints and Their Influence on the Reliability}, series = {Journal of Failure Analysis and Prevention}, volume = {14}, journal = {Journal of Failure Analysis and Prevention}, number = {3}, editor = {Stevenson, Michael}, pages = {272 -- 281}, year = {2014}, subject = {Computertomographie}, language = {de} } @article{BraunwarthAmrheinSchrecketal.2015, author = {Braunwarth, Louisa and Amrhein, Sebastian and Schreck, Timo and Kaloudis, Michael}, title = {Ecological comparison of soldering and sintering as die-attach technologies in power electronics}, series = {Journal of Cleaner Production}, volume = {23}, journal = {Journal of Cleaner Production}, number = {102}, editor = {Huisingh, Donald}, pages = {408 -- 417}, year = {2015}, abstract = {In this study the method of life cycle assessment is used to perform a comparison of two die-attach technologies of power modules: silver sintering and common soldering with a tin-silver-copper solder. The goal of the study is to indicate which die-attach technique is more environmentally friendly. This is important in order to design future electronics more environmentally friendly. Processing covers the manufacturing of the respective pastes, application of pastes, and mounting as well as the subsequent sintering or soldering, including cleaning of the soldered parts. The last step in the processing is a wire bonding process. The environmental impacts are expressed in CO2-equivalents and ReCiPe points and different variants are discussed: comparisons are made between considered pastes and between a soldered and a sintered power module, including consideration of lifetime. Concerning sintering, the influence of using recycled silver is analyzed more closely. The types of stages included in this life cycle assessment best fit a cradle-to-gate assessment, because usage, recycling, and disposal are not included. The software used is OpenLCA version 1.3.3, created by GreenDelta, and the database used is Ecoinvent version 2.2. In order to fill data gaps, electronics manufacturing companies were contacted, and our own calculations and measurements were applied. The consideration of the wet film thicknesses of the soldering system and sintering system, respectively, results in very similar CO2-equivalent emissions for sinter paste and solder paste. Comparing the soldered power module to the sintered one shows minor to significant differences between the two systems which could easily be changed when changing circumstances and assumptions. But when considering the respective lifetimes of the joining technologies, sintering technology is clearly preferable to the conventional soldering technology. Using solely recycled silver for manufacturing of silver sinter paste reduces the CO2-equivalent emissions of one sintered power module by roughly 40\%. The results clearly show the dependence of outcomes on the initial settings. Consideration of lifetime has an enormous impact on the comparison of soldering technology to sintering technology. But the benefit of this life extension through the use of sintering technology is only useful when a long lifetime is required.}, subject = {L{\"o}ten}, language = {de} } @article{RauerKaloudis2014, author = {Rauer, Miriam and Kaloudis, Michael}, title = {Ausfallanalyse an einem Lithium-Ionen Akkumulator}, series = {Maschinenmarkt}, volume = {2014}, journal = {Maschinenmarkt}, number = {2}, pages = {45 -- 46}, year = {2014}, subject = {Lithium-Ionen-Akkumulator}, language = {de} } @article{RauerKaloudis2014, author = {Rauer, Miriam and Kaloudis, Michael}, title = {Computertomographie erweitert das Blickfeld}, series = {Mikroproduktion}, volume = {2014}, journal = {Mikroproduktion}, number = {1}, pages = {50 -- 51}, year = {2014}, subject = {Computertomographie}, language = {de} } @article{DresslerRauerKaloudisetal.2014, author = {Dressler, Katharina and Rauer, Miriam and Kaloudis, Michael and Dauwe, Stefan and Herguth, Axel and Hahn, Giso}, title = {Nondestructive Characterization of Voids in Rear Local Contacts of PERC-Type Solar Cells}, series = {IEEE Journal of Photovoltaics}, volume = {2015}, journal = {IEEE Journal of Photovoltaics}, number = {1}, doi = {10.1109/JPHOTOV.2014.2359745}, pages = {70 -- 76}, year = {2014}, abstract = {In this paper, we present two nondestructive characterization methods for the detection of voids in rear local contacts of passivated emitter and rear-type solar cells, namely scanning acoustic microscopy and computer tomography. We compare both methods and include a comparison with electroluminescence measurements. It is shown in this paper that voids can easily be detected with both measurement types without any sample preparation. We found a good match of scanning acoustic microscopy (SAM) and computer tomography (CT), which is presented for this purpose for the first time. The investigation was carried out for different aluminum pastes.}, subject = {Solarzelle}, language = {de} } @inproceedings{RauerSchreckHaerteretal.2015, author = {Rauer, Miriam and Schreck, Timo and H{\"a}rter, Stefan and Kaloudis, Michael}, title = {The Effect of Thermal Stress on the Reliability of low Ag Solder Joints in High Power LEDs}, series = {20th European Microelectronics and Packaging Conference (EMPC) \& Exhibition, 14.-16.09.2015}, booktitle = {20th European Microelectronics and Packaging Conference (EMPC) \& Exhibition, 14.-16.09.2015}, pages = {1 -- 6}, year = {2015}, subject = {Lumineszenzdiode}, language = {en} } @inproceedings{RauerXuReinhardtetal.2016, author = {Rauer, Miriam and Xu, Ping and Reinhardt, Andreas and Kaloudis, Michael and Franke, J{\"o}rg}, title = {Einfluss von Poren in L{\"o}tverbindungen bei LED-Anwendungen}, series = {Elektronische Baugruppen und Leiterplatten - EBL 2016}, booktitle = {Elektronische Baugruppen und Leiterplatten - EBL 2016}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-4147-2}, pages = {135 -- 139}, year = {2016}, subject = {L{\"o}tverbindung}, language = {de} } @article{AmrheinSchneiderKaloudis2016, author = {Amrhein, Sebastian and Schneider, Mareike and Kaloudis, Michael}, title = {Ein zweites Leben f{\"u}r den Akku}, series = {ReSource}, volume = {2016}, journal = {ReSource}, number = {1}, pages = {10 -- 16}, year = {2016}, subject = {Lithium-Ionen-Akkumulator}, language = {de} } @article{BachmannAmrheinKaloudis2016, author = {Bachmann, Marco and Amrhein, Sebastian and Kaloudis, Michael}, title = {Intelligente Pedelecs f{\"o}rdern. Ein Ansatz zur nachhaltigen Verbesserung unseres Mobilit{\"a}tsverhaltens}, series = {Internationales Verkehrswesen}, volume = {2016}, journal = {Internationales Verkehrswesen}, number = {1}, pages = {16 -- 19}, year = {2016}, subject = {Pedelec}, language = {de} } @inproceedings{SchwarzerChewSchnepfetal.2018, author = {Schwarzer, Christian and Chew, Ly May and Schnepf, Michael and Stoll, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {INVESTIGATION OF COPPER SINTER MATERIAL FOR DIE ATTACH}, series = {SMTA International Conference Proceedings}, volume = {2018}, booktitle = {SMTA International Conference Proceedings}, number = {Proceedings SMTAI 2018}, address = {Rosemont}, organization = {SMTA}, year = {2018}, subject = {Leistungshalbleiter}, language = {en} } @inproceedings{HenselSchwarzerScheetzetal.2018, author = {Hensel, Alexander and Schwarzer, Christian and Scheetz, Matthias and Kaloudis, Michael and Franke, J{\"o}rg}, title = {Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations}, series = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, volume = {2018}, booktitle = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, address = {Singapore}, doi = {10.1109/EPTC.2018.8654421}, pages = {416 -- 421}, year = {2018}, subject = {Leistungselektronik}, language = {en} } @inproceedings{SchmittSchnepfFrankeetal.2019, author = {Schmitt, Wolfgang and Schnepf, Michael and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Investigation of a Sintering Process for Micro-Scale Copper Material}, series = {2019 SMTA Electronic in Harsh Environments Conference}, volume = {2019}, booktitle = {2019 SMTA Electronic in Harsh Environments Conference}, year = {2019}, subject = {Kupfer}, language = {en} } @inproceedings{StenzelSchwarzerSchnepfetal.2019, author = {Stenzel, David and Schwarzer, Christian and Schnepf, Michael and Schmitt, Wolfgang and Blank, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Characterization of Alternative Sinter Materials for Power Electronics}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Leistungselektronik}, language = {en} } @inproceedings{HenselRothMerzetal.2019, author = {Hensel, Alexander and Roth, Frederick and Merz, Corinna and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates in High Temperature Applications}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Sintern}, language = {en} } @article{AmrheinKehrerSchrecketal.2011, author = {Amrhein, Frank and Kehrer, Martin and Schreck, Timo and Bochtler, Ulrich and Hellmann, Ralf and Kaloudis, Michael}, title = {UV-LED-Bestrahlung von Vergussmaterial: Schnelle Aush{\"a}rtung auch im Schatten}, series = {adh{\"a}sion KLEBEN \& DICHTEN}, journal = {adh{\"a}sion KLEBEN \& DICHTEN}, number = {5}, pages = {38 -- 41}, year = {2011}, subject = {Lumineszenzdiode}, language = {de} }