@article{SchreckSchnorpfeilKaloudis2013, author = {Schreck, Timo and Schnorpfeil, Anna and Kaloudis, Michael}, title = {Analysing the growth of intermetallic compounds in lead-free solder joints by differential scanning calorimetry measurements}, series = {Journal of Materials Science}, volume = {48(2013)}, journal = {Journal of Materials Science}, number = {6}, doi = {10.1007/s10853-012-7035-5}, pages = {2476 -- 2484}, year = {2013}, subject = {Differential scanning calorimetry}, language = {en} } @article{RauerKaloudis2014, author = {Rauer, Miriam and Kaloudis, Michael}, title = {Ausfallanalyse an einem Lithium-Ionen Akkumulator}, series = {Maschinenmarkt}, volume = {2014}, journal = {Maschinenmarkt}, number = {2}, pages = {45 -- 46}, year = {2014}, subject = {Lithium-Ionen-Akkumulator}, language = {de} } @article{HeiningerSchreckKaloudis2012, author = {Heininger, Patrick and Schreck, Timo and Kaloudis, Michael}, title = {Buckelschweißen zur zuverl{\"a}ssigen Kontaktierung von Industrieakkumulatoren}, series = {PLUS 14}, journal = {PLUS 14}, number = {5}, pages = {1163 -- 1169}, year = {2012}, subject = {Buckelschweißen}, language = {de} } @inproceedings{StenzelSchwarzerSchnepfetal.2019, author = {Stenzel, David and Schwarzer, Christian and Schnepf, Michael and Schmitt, Wolfgang and Blank, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Characterization of Alternative Sinter Materials for Power Electronics}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Leistungselektronik}, language = {en} } @article{RauerVolkertHaerteretal.2014, author = {Rauer, Miriam and Volkert, Antje and H{\"a}rter, Stefan and Schreck, Timo and Kaloudis, Michael}, title = {Computed-Tomography-Based Analysis of Voids in SnBi57Ag1 Solder Joints and Their Influence on the Reliability}, series = {Journal of Failure Analysis and Prevention}, volume = {14}, journal = {Journal of Failure Analysis and Prevention}, number = {3}, editor = {Stevenson, Michael}, pages = {272 -- 281}, year = {2014}, subject = {Computertomographie}, language = {de} } @article{RauerKaloudis2014, author = {Rauer, Miriam and Kaloudis, Michael}, title = {Computertomographie erweitert das Blickfeld}, series = {Mikroproduktion}, volume = {2014}, journal = {Mikroproduktion}, number = {1}, pages = {50 -- 51}, year = {2014}, subject = {Computertomographie}, language = {de} } @inproceedings{KaloumenosAmrheinGlaabetal.2010, author = {Kaloumenos, Mareiki and Amrhein, Frank and Glaab, Johannes and Sauer, Michael and Hellmann, Ralf and Kaloudis, Michael}, title = {Development of a UV-Light Source with Highest Power Density Based on Light Emitting Diode Technology for Applications in Production Engineering, in Production Engineering and manufacturing Systems}, series = {Proceedings of the XXIV International Scientific Conference Miskolc, Ungarn}, booktitle = {Proceedings of the XXIV International Scientific Conference Miskolc, Ungarn}, year = {2010}, subject = {Lumineszenzdiode}, language = {en} } @article{BraunwarthAmrheinSchrecketal.2015, author = {Braunwarth, Louisa and Amrhein, Sebastian and Schreck, Timo and Kaloudis, Michael}, title = {Ecological comparison of soldering and sintering as die-attach technologies in power electronics}, series = {Journal of Cleaner Production}, volume = {23}, journal = {Journal of Cleaner Production}, number = {102}, editor = {Huisingh, Donald}, pages = {408 -- 417}, year = {2015}, abstract = {In this study the method of life cycle assessment is used to perform a comparison of two die-attach technologies of power modules: silver sintering and common soldering with a tin-silver-copper solder. The goal of the study is to indicate which die-attach technique is more environmentally friendly. This is important in order to design future electronics more environmentally friendly. Processing covers the manufacturing of the respective pastes, application of pastes, and mounting as well as the subsequent sintering or soldering, including cleaning of the soldered parts. The last step in the processing is a wire bonding process. The environmental impacts are expressed in CO2-equivalents and ReCiPe points and different variants are discussed: comparisons are made between considered pastes and between a soldered and a sintered power module, including consideration of lifetime. Concerning sintering, the influence of using recycled silver is analyzed more closely. The types of stages included in this life cycle assessment best fit a cradle-to-gate assessment, because usage, recycling, and disposal are not included. The software used is OpenLCA version 1.3.3, created by GreenDelta, and the database used is Ecoinvent version 2.2. In order to fill data gaps, electronics manufacturing companies were contacted, and our own calculations and measurements were applied. The consideration of the wet film thicknesses of the soldering system and sintering system, respectively, results in very similar CO2-equivalent emissions for sinter paste and solder paste. Comparing the soldered power module to the sintered one shows minor to significant differences between the two systems which could easily be changed when changing circumstances and assumptions. But when considering the respective lifetimes of the joining technologies, sintering technology is clearly preferable to the conventional soldering technology. Using solely recycled silver for manufacturing of silver sinter paste reduces the CO2-equivalent emissions of one sintered power module by roughly 40\%. The results clearly show the dependence of outcomes on the initial settings. Consideration of lifetime has an enormous impact on the comparison of soldering technology to sintering technology. But the benefit of this life extension through the use of sintering technology is only useful when a long lifetime is required.}, subject = {L{\"o}ten}, language = {de} } @article{SchneiderBochtlerHellmannetal.2011, author = {Schneider, Johannes and Bochtler, Ulrich and Hellmann, Ralf and Kaloudis, Michael and Gockel, Tilo}, title = {Effiziente Entw{\"a}rmung eines Hochleistungs-UV-LED-Moduls}, series = {Elektor, Sonderheft LEDs 3}, volume = {2011}, journal = {Elektor, Sonderheft LEDs 3}, number = {9}, pages = {12 -- 17}, year = {2011}, subject = {Lumineszenzdiode}, language = {de} } @article{AmrheinSchneiderKaloudis2016, author = {Amrhein, Sebastian and Schneider, Mareike and Kaloudis, Michael}, title = {Ein zweites Leben f{\"u}r den Akku}, series = {ReSource}, volume = {2016}, journal = {ReSource}, number = {1}, pages = {10 -- 16}, year = {2016}, subject = {Lithium-Ionen-Akkumulator}, language = {de} } @inproceedings{RauerXuReinhardtetal.2016, author = {Rauer, Miriam and Xu, Ping and Reinhardt, Andreas and Kaloudis, Michael and Franke, J{\"o}rg}, title = {Einfluss von Poren in L{\"o}tverbindungen bei LED-Anwendungen}, series = {Elektronische Baugruppen und Leiterplatten - EBL 2016}, booktitle = {Elektronische Baugruppen und Leiterplatten - EBL 2016}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-4147-2}, pages = {135 -- 139}, year = {2016}, subject = {L{\"o}tverbindung}, language = {de} } @article{SahlKaloudis2010, author = {Sahl, Martin and Kaloudis, Michael}, title = {Einsatz von Glasloten zur Erzeugung gasdichter F{\"u}gestellen beim Aufbau von Drucksensoren}, series = {PLUS}, journal = {PLUS}, number = {12}, publisher = {Leuze-Verlag}, address = {Bad Saulgau}, pages = {1367}, year = {2010}, subject = {Drucksensor}, language = {de} } @article{RauerKaloudis2013, author = {Rauer, Miriam and Kaloudis, Michael}, title = {Hinter der Fassade - Ausfallanalyse an einem Lithium-Ionen Akkumulator mittels CT}, series = {QZ Qualit{\"a}t und Zuverl{\"a}ssigkeit}, volume = {2013}, journal = {QZ Qualit{\"a}t und Zuverl{\"a}ssigkeit}, number = {1}, pages = {40 -- 41}, year = {2013}, subject = {Lithium-Ionen-Akkumulator}, language = {de} } @inproceedings{SauerKeferRuppertetal.2019, author = {Sauer, Theresia and Kefer, Stefan and Ruppert, Wolfgang and Hellmann, Ralf and Kaloudis, Michael}, title = {Integration of Bragg grating sensors in components made of carbon fiber reinforced polymers}, series = {Tagungsband der 20. GMA/ITG-Fachtagung Sensoren und Messsysteme 2019, 25.06.2019 - 26.06.2019, N{\"u}rnberg, Deutschland}, booktitle = {Tagungsband der 20. GMA/ITG-Fachtagung Sensoren und Messsysteme 2019, 25.06.2019 - 26.06.2019, N{\"u}rnberg, Deutschland}, isbn = {978-3-9819376-0-2}, doi = {10.5162/sensoren2019/P3.12}, pages = {806 -- 810}, year = {2019}, abstract = {This contribution discusses the integration of polymer planar Bragg grating sensors (PPBG) into carbon fiber reinforced polymer (CFRP) components. For the first time, it is shown that PPBGs based on cyclic olefin copolymers can be integrated into commercial-grade composites, thereby withstanding the demanding production processes. Pre-impregnated fibers are stacked and partially modified to form a sensor pocket. Afterwards, the CFRP specimen containing the optical sensor is cured in a heated mechanical press for 2 hours at a pressure of 7 bar and a temperature of 120 °C. A subsequent evalutaion of the sensor signal shows a Bragg wavelength shift of 1236 pm and a decline in signal amplitude of -2 dB. Three-point flexural tests of the cured sample reveal a linear behavior of the sensor signal towards external loads. The determined sensitivity in dependence of the CFRP specimen's maximum central deflection is -112 pm/mm, while correlation to the applied force results in a sensitivity of -5 pm/N.}, subject = {Bragg-Reflektor}, language = {en} } @article{BachmannAmrheinKaloudis2016, author = {Bachmann, Marco and Amrhein, Sebastian and Kaloudis, Michael}, title = {Intelligente Pedelecs f{\"o}rdern. Ein Ansatz zur nachhaltigen Verbesserung unseres Mobilit{\"a}tsverhaltens}, series = {Internationales Verkehrswesen}, volume = {2016}, journal = {Internationales Verkehrswesen}, number = {1}, pages = {16 -- 19}, year = {2016}, subject = {Pedelec}, language = {de} } @article{FuchsSchreckKaloudis2012, author = {Fuchs, Christopher and Schreck, Timo and Kaloudis, Michael}, title = {Interfacial reactions between Sn 57Bi 1Ag solder and electroless Ni-P/immersion Au under solid-state aging}, series = {Journal of Materials Science}, volume = {47}, journal = {Journal of Materials Science}, number = {9}, pages = {4036 -- 4041}, year = {2012}, subject = {Intermetallische Verbindungen}, language = {en} } @inproceedings{SchmittSchnepfFrankeetal.2019, author = {Schmitt, Wolfgang and Schnepf, Michael and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Investigation of a Sintering Process for Micro-Scale Copper Material}, series = {2019 SMTA Electronic in Harsh Environments Conference}, volume = {2019}, booktitle = {2019 SMTA Electronic in Harsh Environments Conference}, year = {2019}, subject = {Kupfer}, language = {en} } @inproceedings{SchwarzerChewSchnepfetal.2018, author = {Schwarzer, Christian and Chew, Ly May and Schnepf, Michael and Stoll, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {INVESTIGATION OF COPPER SINTER MATERIAL FOR DIE ATTACH}, series = {SMTA International Conference Proceedings}, volume = {2018}, booktitle = {SMTA International Conference Proceedings}, number = {Proceedings SMTAI 2018}, address = {Rosemont}, organization = {SMTA}, year = {2018}, subject = {Leistungshalbleiter}, language = {en} } @inproceedings{HenselRothMerzetal.2019, author = {Hensel, Alexander and Roth, Frederick and Merz, Corinna and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates in High Temperature Applications}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Sintern}, language = {en} } @inproceedings{HenselSchwarzerScheetzetal.2018, author = {Hensel, Alexander and Schwarzer, Christian and Scheetz, Matthias and Kaloudis, Michael and Franke, J{\"o}rg}, title = {Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations}, series = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, volume = {2018}, booktitle = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, address = {Singapore}, doi = {10.1109/EPTC.2018.8654421}, pages = {416 -- 421}, year = {2018}, subject = {Leistungselektronik}, language = {en} } @article{BochtlerHellmannKaloudisetal.2010, author = {Bochtler, Ulrich and Hellmann, Ralf and Kaloudis, Michael and Amrhein, Frank and Glaab, Johannes and Kaloumenos, Mareiki and Sauer, Michael and Gockel, Tilo}, title = {LUVLED - UV-Leistungslichtquelle auf Leuchtdiodenbasis}, series = {Elektor Sonderheft, LEDs 2}, volume = {2011}, journal = {Elektor Sonderheft, LEDs 2}, number = {2}, publisher = {Elektor-Verlag}, address = {Aachen}, pages = {57 -- 63}, year = {2010}, subject = {Lumineszenzdiode}, language = {de} } @article{SchneiderBochtlerHellmannetal.2012, author = {Schneider, Johannes and Bochtler, Ulrich and Hellmann, Ralf and Kaloudis, Michael and Gockel, Tilo}, title = {LUVLED III - Optimierung eines K{\"u}hlkonzeptes zur Aktivluftk{\"u}hlung eines Hochleistungs-UV-LED-Moduls}, series = {Zeitschrift ELEKTOR, Sonderheft LED-Special 4 - Leuchtdioden in Theorie und Praxis, 2012}, journal = {Zeitschrift ELEKTOR, Sonderheft LED-Special 4 - Leuchtdioden in Theorie und Praxis, 2012}, number = {9}, pages = {20 -- 29}, year = {2012}, subject = {Lumineszenzdiode}, language = {de} } @article{FuchsSchreckKaloudis2011, author = {Fuchs, Christopher and Schreck, Timo and Kaloudis, Michael}, title = {Metallographische Untersuchungen an Sn-8Zn-3Bi-L{\"o}tverbindungen}, series = {PLUS}, volume = {13}, journal = {PLUS}, number = {10}, pages = {2378 -- 2384}, year = {2011}, subject = {L{\"o}tverbindung}, language = {de} } @article{KeferSauerHessleretal.2020, author = {Kefer, Stefan and Sauer, Theresia and Hessler, Steffen and Kaloudis, Michael and Hellmann, Ralf}, title = {Microstructure-Based Fiber-to-Chip Coupling of Polymer Planar Bragg Gratings for Harsh Environment Applications}, series = {Sensors (Basel)}, volume = {20}, journal = {Sensors (Basel)}, number = {19}, doi = {10.3390/s20195452}, pages = {5452 -- 5452}, year = {2020}, abstract = {This article proposes and demonstrates a robust microstructure-based fiber-to-chip coupling scheme for planar Bragg grating devices. A polymer planar Bragg grating substrate is manufactured and microstructured by means of a micromilling process, while the respective photonic structures are generated by employing a sophisticated single-writing UV-exposure method. A stripped standard single mode fiber is inserted into the microstructure, which is filled with a UV-curable adhesive, and aligned with the integrated waveguide. After curing, final sensor assembly and thermal treatment, the proposed coupling scheme is capable of withstanding pressures up to 10 bar, at room temperature, and pressures up to 7.5 bar at an elevated temperature of 120 °C. Additionally, the coupling scheme is exceedingly robust towards tensile forces, limited only by the tensile strength of the employed single mode fiber. Due to its outstanding robustness, the coupling scheme enables the application of planar Bragg grating devices in harsh environments. This fact is underlined by integrating a microstructure-coupled photonic device into the center of a commercial-grade carbon fiber-reinforced polymer specimen. After its integration, the polymer-based Bragg grating sensor still exhibits a reflection peak with a dynamic range of 24 dB, and can thus be employed for sensing purposes.}, language = {en} } @incollection{KeferRothKaloudisetal.2021, author = {Kefer, Stefan and Roth, Frederick and Kaloudis, Michael and Schmauss, Bernhard and Hellmann, Ralf}, title = {Monitoring of Composite Bicycle Components using Polymer Planar Bragg Gratings}, series = {SMSI 2021 - Sensors and Instrumentation}, booktitle = {SMSI 2021 - Sensors and Instrumentation}, publisher = {AMA Service GmbH}, address = {Wunstorf, Germany}, isbn = {978-3-9819376-4-0}, doi = {10.5162/SMSI2021/B9.2}, pages = {161 -- 162}, year = {2021}, abstract = {This study demonstrates mobile load monitoring of a composite bicycle component using an application- customized polymer planar Bragg grating sensor, evaluated by a mobile interrogation unit. After a referencing procedure, the mechanical load of a seat post is monitored while cycling through a test track.}, subject = {Bragg-Reflektor}, language = {en} } @article{AmrheinKehrerSchrecketal.2011, author = {Amrhein, Frank and Kehrer, Martin and Schreck, Timo and Bochtler, Ulrich and Hellmann, Ralf and Kaloudis, Michael}, title = {More efficient curing of UV sensitive mounting materials}, series = {Practical metallography}, volume = {48}, journal = {Practical metallography}, number = {7}, pages = {356 -- 364}, year = {2011}, subject = {Aush{\"a}rtung}, language = {en} } @article{BochtlerHellmannKaloudis2010, author = {Bochtler, Ulrich and Hellmann, Ralf and Kaloudis, Michael}, title = {Neuartige UV-Lichtquelle auf Leuchtdiodenbasis, Packaging und Hybridschaltungen}, series = {PLUS}, journal = {PLUS}, number = {2}, publisher = {Leuze-Verlag}, year = {2010}, subject = {Lumineszenzdiode}, language = {de} } @article{DresslerRauerKaloudisetal.2014, author = {Dressler, Katharina and Rauer, Miriam and Kaloudis, Michael and Dauwe, Stefan and Herguth, Axel and Hahn, Giso}, title = {Nondestructive Characterization of Voids in Rear Local Contacts of PERC-Type Solar Cells}, series = {IEEE Journal of Photovoltaics}, volume = {2015}, journal = {IEEE Journal of Photovoltaics}, number = {1}, doi = {10.1109/JPHOTOV.2014.2359745}, pages = {70 -- 76}, year = {2014}, abstract = {In this paper, we present two nondestructive characterization methods for the detection of voids in rear local contacts of passivated emitter and rear-type solar cells, namely scanning acoustic microscopy and computer tomography. We compare both methods and include a comparison with electroluminescence measurements. It is shown in this paper that voids can easily be detected with both measurement types without any sample preparation. We found a good match of scanning acoustic microscopy (SAM) and computer tomography (CT), which is presented for this purpose for the first time. The investigation was carried out for different aluminum pastes.}, subject = {Solarzelle}, language = {de} } @article{WohlschloegelKaloudis2011, author = {Wohlschl{\"o}gel, Timo and Kaloudis, Michael}, title = {Praktische Oberfl{\"a}chenanalytik - {\"U}berblick {\"u}ber die Verfahren EDX, AES, XPS und SIMS}, series = {Galvanotechnik}, journal = {Galvanotechnik}, number = {12}, pages = {2637 -- 2646}, year = {2011}, subject = {Oberfl{\"a}chenanalyse}, language = {de} } @article{KeferSauerHessleretal.2020, author = {Kefer, Stefan and Sauer, Theresia and Hessler, Steffen and Kaloudis, Michael and Schmauß, Bernhard and Hellmann, Ralf}, title = {Robust Polymer Planar Bragg Grating Sensors Embedded in Commercial-Grade Composites}, series = {Polymers}, volume = {12}, journal = {Polymers}, number = {3}, doi = {10.3390/polym12030715}, pages = {715 -- 715}, year = {2020}, abstract = {This contribution demonstrates the functionality of polymer planar Bragg grating (PPBG) sensors integrated into commercial-grade carbon fiber reinforced polymer (CFRP) components. Multiple CFRP specimens are generated by curing a stack of pre-impregnated fibers inside of a heated mechanical press, exposing the polymer sensor to a pressure of 7 bar and a temperature of 120 °C for 2 h. After integration, the sensor still exhibits a strong and evaluable signal. Subsequent flexural experiments reveal a linear response of the integrated sensor's Bragg wavelength to the CFRP specimen's maximum deflection. Additional findings demonstrate that the embedded PPBG can be used to detect plastic deformations of a CFRP workpiece, whereas a linear correlation of plastic deformation to the resulting Bragg signal offset is determined. A plausibility check of the obtained results is delivered by a comparison of three-point flexural experiments on bulk CFRP workpieces, without integrated sensors and additional specimens featuring external optical sensors affixed to their surface. It is found that PPBGs based on cyclic olefin copolymers are able to overcome the temperature-related limitations of traditional polymer-based optical sensors and can thus be directly integrated into commercial-grade composites during production.}, subject = {Bragg-Reflektor}, language = {en} } @inproceedings{RauerSchreckHaerteretal.2015, author = {Rauer, Miriam and Schreck, Timo and H{\"a}rter, Stefan and Kaloudis, Michael}, title = {The Effect of Thermal Stress on the Reliability of low Ag Solder Joints in High Power LEDs}, series = {20th European Microelectronics and Packaging Conference (EMPC) \& Exhibition, 14.-16.09.2015}, booktitle = {20th European Microelectronics and Packaging Conference (EMPC) \& Exhibition, 14.-16.09.2015}, pages = {1 -- 6}, year = {2015}, subject = {Lumineszenzdiode}, language = {en} } @article{AmrheinKehrerSchrecketal.2011, author = {Amrhein, Frank and Kehrer, Martin and Schreck, Timo and Bochtler, Ulrich and Hellmann, Ralf and Kaloudis, Michael}, title = {UV-LED-Bestrahlung von Vergussmaterial: Schnelle Aush{\"a}rtung auch im Schatten}, series = {adh{\"a}sion KLEBEN \& DICHTEN}, journal = {adh{\"a}sion KLEBEN \& DICHTEN}, number = {5}, pages = {38 -- 41}, year = {2011}, subject = {Lumineszenzdiode}, language = {de} } @article{AmrheinBochtlerHellmannetal.2010, author = {Amrhein, Frank and Bochtler, Ulrich and Hellmann, Ralf and Kaloudis, Michael and Kaloumenos, Mareiki}, title = {Vergleich der thermischen Eigenschaften unterschiedlicher insulated metal substrat-Leiterplatten}, series = {PLUS, Leiterplattentechnik}, journal = {PLUS, Leiterplattentechnik}, number = {8}, publisher = {Hanser Verlag}, address = {M{\"u}nchen}, pages = {1758}, year = {2010}, subject = {Gedruckte Schaltung}, language = {de} } @article{RauerSchreckKaloudis2013, author = {Rauer, Miriam and Schreck, Timo and Kaloudis, Michael}, title = {X-Ray Computed Tomography as Supporting Technology in the Failure Analysis of Press-In Connections for Electronic Assemblies}, series = {Practical Metallography}, volume = {50(2013)}, journal = {Practical Metallography}, number = {3}, pages = {205 -- 221}, year = {2013}, subject = {Fehleranalyse}, language = {en} }