@article{SchreckSchnorpfeilKaloudis2013, author = {Schreck, Timo and Schnorpfeil, Anna and Kaloudis, Michael}, title = {Analysing the growth of intermetallic compounds in lead-free solder joints by differential scanning calorimetry measurements}, series = {Journal of Materials Science}, volume = {48(2013)}, journal = {Journal of Materials Science}, number = {6}, doi = {10.1007/s10853-012-7035-5}, pages = {2476 -- 2484}, year = {2013}, subject = {Differential scanning calorimetry}, language = {en} } @article{RauerKaloudis2014, author = {Rauer, Miriam and Kaloudis, Michael}, title = {Ausfallanalyse an einem Lithium-Ionen Akkumulator}, series = {Maschinenmarkt}, volume = {2014}, journal = {Maschinenmarkt}, number = {2}, pages = {45 -- 46}, year = {2014}, subject = {Lithium-Ionen-Akkumulator}, language = {de} } @article{HeiningerSchreckKaloudis2012, author = {Heininger, Patrick and Schreck, Timo and Kaloudis, Michael}, title = {Buckelschweißen zur zuverl{\"a}ssigen Kontaktierung von Industrieakkumulatoren}, series = {PLUS 14}, journal = {PLUS 14}, number = {5}, pages = {1163 -- 1169}, year = {2012}, subject = {Buckelschweißen}, language = {de} } @inproceedings{StenzelSchwarzerSchnepfetal.2019, author = {Stenzel, David and Schwarzer, Christian and Schnepf, Michael and Schmitt, Wolfgang and Blank, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Characterization of Alternative Sinter Materials for Power Electronics}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Leistungselektronik}, language = {en} } @article{RauerVolkertHaerteretal.2014, author = {Rauer, Miriam and Volkert, Antje and H{\"a}rter, Stefan and Schreck, Timo and Kaloudis, Michael}, title = {Computed-Tomography-Based Analysis of Voids in SnBi57Ag1 Solder Joints and Their Influence on the Reliability}, series = {Journal of Failure Analysis and Prevention}, volume = {14}, journal = {Journal of Failure Analysis and Prevention}, number = {3}, editor = {Stevenson, Michael}, pages = {272 -- 281}, year = {2014}, subject = {Computertomographie}, language = {de} } @article{RauerKaloudis2014, author = {Rauer, Miriam and Kaloudis, Michael}, title = {Computertomographie erweitert das Blickfeld}, series = {Mikroproduktion}, volume = {2014}, journal = {Mikroproduktion}, number = {1}, pages = {50 -- 51}, year = {2014}, subject = {Computertomographie}, language = {de} } @inproceedings{KaloumenosAmrheinGlaabetal.2010, author = {Kaloumenos, Mareiki and Amrhein, Frank and Glaab, Johannes and Sauer, Michael and Hellmann, Ralf and Kaloudis, Michael}, title = {Development of a UV-Light Source with Highest Power Density Based on Light Emitting Diode Technology for Applications in Production Engineering, in Production Engineering and manufacturing Systems}, series = {Proceedings of the XXIV International Scientific Conference Miskolc, Ungarn}, booktitle = {Proceedings of the XXIV International Scientific Conference Miskolc, Ungarn}, year = {2010}, subject = {Lumineszenzdiode}, language = {en} } @article{BraunwarthAmrheinSchrecketal.2015, author = {Braunwarth, Louisa and Amrhein, Sebastian and Schreck, Timo and Kaloudis, Michael}, title = {Ecological comparison of soldering and sintering as die-attach technologies in power electronics}, series = {Journal of Cleaner Production}, volume = {23}, journal = {Journal of Cleaner Production}, number = {102}, editor = {Huisingh, Donald}, pages = {408 -- 417}, year = {2015}, abstract = {In this study the method of life cycle assessment is used to perform a comparison of two die-attach technologies of power modules: silver sintering and common soldering with a tin-silver-copper solder. The goal of the study is to indicate which die-attach technique is more environmentally friendly. This is important in order to design future electronics more environmentally friendly. Processing covers the manufacturing of the respective pastes, application of pastes, and mounting as well as the subsequent sintering or soldering, including cleaning of the soldered parts. The last step in the processing is a wire bonding process. The environmental impacts are expressed in CO2-equivalents and ReCiPe points and different variants are discussed: comparisons are made between considered pastes and between a soldered and a sintered power module, including consideration of lifetime. Concerning sintering, the influence of using recycled silver is analyzed more closely. The types of stages included in this life cycle assessment best fit a cradle-to-gate assessment, because usage, recycling, and disposal are not included. The software used is OpenLCA version 1.3.3, created by GreenDelta, and the database used is Ecoinvent version 2.2. In order to fill data gaps, electronics manufacturing companies were contacted, and our own calculations and measurements were applied. The consideration of the wet film thicknesses of the soldering system and sintering system, respectively, results in very similar CO2-equivalent emissions for sinter paste and solder paste. Comparing the soldered power module to the sintered one shows minor to significant differences between the two systems which could easily be changed when changing circumstances and assumptions. But when considering the respective lifetimes of the joining technologies, sintering technology is clearly preferable to the conventional soldering technology. Using solely recycled silver for manufacturing of silver sinter paste reduces the CO2-equivalent emissions of one sintered power module by roughly 40\%. The results clearly show the dependence of outcomes on the initial settings. Consideration of lifetime has an enormous impact on the comparison of soldering technology to sintering technology. But the benefit of this life extension through the use of sintering technology is only useful when a long lifetime is required.}, subject = {L{\"o}ten}, language = {de} } @article{SchneiderBochtlerHellmannetal.2011, author = {Schneider, Johannes and Bochtler, Ulrich and Hellmann, Ralf and Kaloudis, Michael and Gockel, Tilo}, title = {Effiziente Entw{\"a}rmung eines Hochleistungs-UV-LED-Moduls}, series = {Elektor, Sonderheft LEDs 3}, volume = {2011}, journal = {Elektor, Sonderheft LEDs 3}, number = {9}, pages = {12 -- 17}, year = {2011}, subject = {Lumineszenzdiode}, language = {de} } @article{AmrheinSchneiderKaloudis2016, author = {Amrhein, Sebastian and Schneider, Mareike and Kaloudis, Michael}, title = {Ein zweites Leben f{\"u}r den Akku}, series = {ReSource}, volume = {2016}, journal = {ReSource}, number = {1}, pages = {10 -- 16}, year = {2016}, subject = {Lithium-Ionen-Akkumulator}, language = {de} }