@inproceedings{RauerSchreckHaerteretal.2015, author = {Rauer, Miriam and Schreck, Timo and H{\"a}rter, Stefan and Kaloudis, Michael}, title = {The Effect of Thermal Stress on the Reliability of low Ag Solder Joints in High Power LEDs}, series = {20th European Microelectronics and Packaging Conference (EMPC) \& Exhibition, 14.-16.09.2015}, booktitle = {20th European Microelectronics and Packaging Conference (EMPC) \& Exhibition, 14.-16.09.2015}, pages = {1 -- 6}, year = {2015}, subject = {Lumineszenzdiode}, language = {en} } @inproceedings{RauerXuReinhardtetal.2016, author = {Rauer, Miriam and Xu, Ping and Reinhardt, Andreas and Kaloudis, Michael and Franke, J{\"o}rg}, title = {Einfluss von Poren in L{\"o}tverbindungen bei LED-Anwendungen}, series = {Elektronische Baugruppen und Leiterplatten - EBL 2016}, booktitle = {Elektronische Baugruppen und Leiterplatten - EBL 2016}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-4147-2}, pages = {135 -- 139}, year = {2016}, subject = {L{\"o}tverbindung}, language = {de} } @article{AmrheinSchneiderKaloudis2016, author = {Amrhein, Sebastian and Schneider, Mareike and Kaloudis, Michael}, title = {Ein zweites Leben f{\"u}r den Akku}, series = {ReSource}, volume = {2016}, journal = {ReSource}, number = {1}, pages = {10 -- 16}, year = {2016}, subject = {Lithium-Ionen-Akkumulator}, language = {de} } @article{BachmannAmrheinKaloudis2016, author = {Bachmann, Marco and Amrhein, Sebastian and Kaloudis, Michael}, title = {Intelligente Pedelecs f{\"o}rdern. Ein Ansatz zur nachhaltigen Verbesserung unseres Mobilit{\"a}tsverhaltens}, series = {Internationales Verkehrswesen}, volume = {2016}, journal = {Internationales Verkehrswesen}, number = {1}, pages = {16 -- 19}, year = {2016}, subject = {Pedelec}, language = {de} } @inproceedings{SchwarzerChewSchnepfetal.2018, author = {Schwarzer, Christian and Chew, Ly May and Schnepf, Michael and Stoll, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {INVESTIGATION OF COPPER SINTER MATERIAL FOR DIE ATTACH}, series = {SMTA International Conference Proceedings}, volume = {2018}, booktitle = {SMTA International Conference Proceedings}, number = {Proceedings SMTAI 2018}, address = {Rosemont}, organization = {SMTA}, year = {2018}, subject = {Leistungshalbleiter}, language = {en} } @inproceedings{HenselSchwarzerScheetzetal.2018, author = {Hensel, Alexander and Schwarzer, Christian and Scheetz, Matthias and Kaloudis, Michael and Franke, J{\"o}rg}, title = {Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations}, series = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, volume = {2018}, booktitle = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, address = {Singapore}, doi = {10.1109/EPTC.2018.8654421}, pages = {416 -- 421}, year = {2018}, subject = {Leistungselektronik}, language = {en} } @inproceedings{SchmittSchnepfFrankeetal.2019, author = {Schmitt, Wolfgang and Schnepf, Michael and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Investigation of a Sintering Process for Micro-Scale Copper Material}, series = {2019 SMTA Electronic in Harsh Environments Conference}, volume = {2019}, booktitle = {2019 SMTA Electronic in Harsh Environments Conference}, year = {2019}, subject = {Kupfer}, language = {en} } @inproceedings{StenzelSchwarzerSchnepfetal.2019, author = {Stenzel, David and Schwarzer, Christian and Schnepf, Michael and Schmitt, Wolfgang and Blank, Thomas and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Characterization of Alternative Sinter Materials for Power Electronics}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Leistungselektronik}, language = {en} } @inproceedings{HenselRothMerzetal.2019, author = {Hensel, Alexander and Roth, Frederick and Merz, Corinna and Franke, J{\"o}rg and Kaloudis, Michael}, title = {Investigation of Pressureless Sintered Interconnections on Plasma Based Additive Copper Metallization for 3-Dimentional Ceramic Substrates in High Temperature Applications}, series = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, booktitle = {22nd Microelectronics and Packaging Conference (EMPC) \& Exhibition, 16 Sep 2019 - 19 Sep 2019, Conference Center PISA, Italy}, year = {2019}, subject = {Sintern}, language = {en} } @article{AmrheinKehrerSchrecketal.2011, author = {Amrhein, Frank and Kehrer, Martin and Schreck, Timo and Bochtler, Ulrich and Hellmann, Ralf and Kaloudis, Michael}, title = {UV-LED-Bestrahlung von Vergussmaterial: Schnelle Aush{\"a}rtung auch im Schatten}, series = {adh{\"a}sion KLEBEN \& DICHTEN}, journal = {adh{\"a}sion KLEBEN \& DICHTEN}, number = {5}, pages = {38 -- 41}, year = {2011}, subject = {Lumineszenzdiode}, language = {de} }