TY - CONF A1 - Franz, Daniel A1 - Mücke, Dominik A1 - Kunz, Tim A1 - Rung, Stefan A1 - Esen, Cemal A1 - Hellmann, Ralf T1 - UV picosecond laser drilling of ABF film material for printed circuit boards using laser burst mode and beam shaping T2 - International Congress on Applications of Lasers & Electro-Optics (ICALEO) 2023 N2 - We report on an experimental study of laser microvia percussion drilling of Ajinomoto build-up film (ABF) material using an ultrashort pulsed laser in the ultraviolet region. In order to optimize the drilling quality in terms of the fabricated taper and microvia diameter, the MHz burst mode is used in combination with both a Gaussian and a top-hat laser intensity distribution. To evaluate the influence of the top-hat beam shape on defocusing, microvias were drilled at different z-positions in the range of 200 μm evenly distributed around the focal plane. The drilling quality was evaluated by laser scanning microscopy and metallography. When using a top-hat beam shape, a reduced taper of down to 26.8 % on average is achieved compared to a Gaussian beam. For the application of 3 intra-burst pulses, we find an improvement of the taper by 11.6% compared to the single pulse mode due to the increasing heat accumulation. Using a top-hat beam shape in combination with the MHz burst mode, an 18.2 % reduction in laser drilling time for a microvia with a similar taper is remarkable, demonstrating the high potential for scaling throughput in electronics manufacturing. KW - Pikosekundenbereich KW - Laserbohren Y1 - 2023 UR - https://opus4.kobv.de/opus4-h-ab/frontdoor/index/index/docId/2243 ER -