TY - CONF A1 - Hensel, Alexander A1 - Schwarzer, Christian A1 - Scheetz, Matthias A1 - Kaloudis, Michael A1 - Franke, Jörg T1 - Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations T2 - 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) KW - Leistungselektronik KW - Hochtemperatur KW - Sintern Y1 - 2019 UR - https://opus4.kobv.de/opus4-h-ab/frontdoor/index/index/docId/1399 VL - 2018 SP - 416 EP - 421 CY - Singapore ER -