@inproceedings{HenselSchwarzerScheetzetal.2019, author = {Alexander Hensel and Christian Schwarzer and Matthias Scheetz and Michael Kaloudis and J{\"o}rg Franke}, title = {Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations}, booktitle = {2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)}, volume = {2018}, pages = {416 -- 421}, doi = {10.1109/EPTC.2018.8654421}, year = {2019}, }