TY - CONF A1 - Schmitt, Wolfgang A1 - Schnepf, Michael A1 - Franke, Jörg A1 - Kaloudis, Michael T1 - Investigation of a Sintering Process for Micro-Scale Copper Material T2 - 2019 SMTA Electronic in Harsh Environments Conference KW - Kupfer KW - Sintern Y1 - 2019 UR - https://opus4.kobv.de/opus4-h-ab/frontdoor/index/index/docId/1402 VL - 2019 ER -