TY - CONF A1 - Rauer, Miriam A1 - Schreck, Timo A1 - Härter, Stefan A1 - Kaloudis, Michael T1 - The Effect of Thermal Stress on the Reliability of low Ag Solder Joints in High Power LEDs T2 - 20th European Microelectronics and Packaging Conference (EMPC) & Exhibition, 14.-16.09.2015 KW - Lumineszenzdiode KW - Thermische Belastung KW - Zuverlässigkeit KW - Lötverbindung Y1 - 2016 UR - https://opus4.kobv.de/opus4-h-ab/frontdoor/index/index/docId/716 SP - 1 EP - 6 ER -