TY - CHAP A1 - Kolb, Ronny A1 - John, Isabel A1 - Knodel, Jens A1 - Muthig, Dirk A1 - Haury, Uwe A1 - Meier, Gerald T1 - Experiences with product line development of embedded systems at testo AG T2 - 10th International Software Product Line Conference (SPLC'06) N2 - Product line practices are increasingly becoming popular in the domain of embedded software systems. This paper presents results of assessing success, consistency, and quality of Testo's product line of climate and flue gas measurement devices after its construction and the delivery of three commercial products. The results of the assessment showed that the incremental introduction of architecture-centric product line development can be considered successful even though there is no quantifiable reduction of time-to-market as well as development and maintenance costs so far. The success is mainly shown by the ability of Testo to develop more complex products and the satisfaction of the involved developers. A major issue encountered is ensuring the quality of reusable components and the conformance of the products to the architecture during development and maintenance KW - Embedded system KW - System testing KW - Software testing KW - Costs KW - Investments KW - Business KW - Temperature measurement KW - Software engineering KW - Embedded software KW - Flue gases KW - Production Line KW - Testo AG KW - Product Line Development KW - Components Of Quality KW - Quality Assurance KW - Product Development KW - Source Code KW - Model Architecture KW - Development Efforts KW - Layering KW - Component Of Development KW - Reverse Engineering KW - Unified Modeling Language KW - Phases Of Life Cycle KW - Software Product KW - Development Of Architecture KW - Quality Of Implementation KW - Components Of The Framework KW - Production Team KW - Exclamation Mark KW - Reference Architecture KW - Quality Assurance Activities KW - Clone Detection KW - View Of Architecture KW - Partial Products KW - Software Architecture Y1 - 2006 U6 - https://doi.org/10.1109/SPLINE.2006.1691589 SP - 172 EP - 181 PB - IEEE ER -