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The reliability of interconnects on integrated circuits (IC) has become a major problem in recent years because of the rise of complexity, the low-k-insulating material with reduced stability, and wear-out-effects from high current densities. The total reliability of a system on a chip is increasingly influenced by the reliability of the interconnections, which is caused by increased communication from the elevated number of integrated functional units. In recent years, studies have predicted that static faults will occur more often decreasing the reliability and the mean time to failure. The most published solutions aim to prevent dynamic faults and to correct transient faults. However, built-in self-repair (BISR) as a solution for static faults has not previously been discussed along with the other possible solutions. Theoretically, BISR can lead to higher reliability and lifetime. This is my motivation to implement BISR for integrated interconnects. Because BISR cannot repair transient and dynamic faults, I combine BISR with other approved solutions in this thesis. The results show that the combination leads to higher reliability and lifetime with less area and static power overhead compared to the existing solutions.