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Adhesive bonding is the preferred bonding method for a lot of different application because of is particularities. As an example, adhesive bonding does not require to drill holes like for riveting or screwing. Thin and fragile material as well as of different arts can be successfully joined using adhesives. Moreover, adhesive bonding provides a uniform load distribution within the bonding joint during mechanical load. For these reasons, adhesive bonding should be used systemically for joining fiber reinforced polymers, since the fibers would be damaged by drilled holes. The mechanical properties of the parts given by the fibers would then remain. The problem is that it is very difficult to separate adhesively bonded structures. The first layer of fibers is often damaged by rough mechanical separation, or the resin matrix is damaged because of high temperatures applied. For these reasons, fibers reinforced polymers are up to now still very often screwed or riveted. New adhesive systems that allow debonding of structural bonding joints are developed and investigated in this work. For this purpose, epoxide and polyurethane adhesive are modified with foaming agents that weaken the adhesive above their expansion temperature. These modified adhesive should keep properties as close as possible to the properties of the unmodified adhesives. The expansion temperature should be above the upper service temperature of the adhesive as far as possible but also below the limit of the thermal stability of the substrates. This is contradictory and the window of temperature at which the expansion should take place is very narrow. In a second method, a commercial electrically disbonding adhesive is used in combination with fiber reinforced polymer substrates. This adhesive can be electrically disbonded by applying a voltage at the terminals of the adhesive. Therefore, electrically conductive substrates are necessary and the metallization of the fiber reinforced polymer substrates is investigated.