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High-resolution imaging of buried metal interconnect structures in advanced microelectronic products with full-field X-ray microscopy is demonstrated in the hard X-ray regime, i.e., at photon energies > 10 keV. The combination of two multilayer optics—a side-by-side Montel (or nested Kirkpatrick–Baez) condenser optic and a high aspect-ratio multilayer Laue lens—results in an asymmetric optical path in the transmission X-ray microscope. This optics arrangement allows the imaging of 3D nanostructures in opaque objects at a photon energy of 24.2 keV (In-Kα X-ray line). Using a Siemens star test pattern with a minimal feature size of 150 nm, it was proven that features < 150 nm can be resolved. In-Kα radiation is generated from a Ga-In alloy target using a laboratory X-ray source that employs the liquid-metal-jet technology. Since the penetration depth of X-rays into the samples is significantly larger compared to 8 keV photons used in state-of-the-art laboratory X-ray microscopes (Cu-Kα radiation), 3D-nanopattered materials and structures can be imaged nondestructively in mm to cm thick samples. This means that destructive de-processing, thinning or cross-sectioning of the samples are not needed for the visualization of interconnect structures in microelectronic products manufactured using advanced packaging technologies. The application of laboratory transmission X-ray microscopy in the hard X-ray regime is demonstrated for Cu/Cu6Sn5/Cu microbump interconnects fabricated using solid–liquid interdiffusion (SLID) bonding.
Comparative STM-based study of thermal evolution of Co and Ni germanide nanostructures on Ge(001)
(2015)
Since 1947, when Bardeen and Brattain initiated the era of microelectronics by constructing the first Germanium (Ge) transistor, semiconductors have become the main material platform for advanced integrated circuit (IC) technologies. Later on, given in particular the electrical stability of its native oxide, IC technology shifted from Ge to Silicon (Si) substrates and the dominance of Si-based complementary metal oxide semiconductor (CMOS) microelectronics is today unquestionable. However, as the semiconductor industry is approaching the limits of traditional Si CMOS scaling, the integration of new materials into Si micro- and nano-electronics is required to extend the performance and functionality of future CMOS-based IC technologies.
Recently, Ge due to its superior optoelectronic properties and compatibility with conventional Si CMOS technology has re-emerged as an alternative semiconductor material on the mainstream Si technology platform. Many of the Ge integration challenges, such as e.g. doping, epitaxial quality etc., have been recently solved or minimized to an acceptable level. However, the fabrication of low resistance, thermally stable metal/Ge contacts is still one of the main barriers towards the full use of the potential offered by Ge. In particular, the formation of ohmic contacts is relevant for applications where high current densities are of importance (i.p. Ge p-MOSFET and Ge laser applications). Consequently, intensive investigations of metal/Ge contacts are imperative for future applications of Ge.
Various metal/Ge contact systems were studied and demonstrated good thermal stability and promising electrical properties. However, given their widespread use in Si CMOS technologies in form of their respective silicides, Co- and Ni-germanides seem to be an obvious choice for electrical contacts in Ge-based devices. Both metal/Ge systems exhibit a complex bulk phase diagrams with a wide range of different physical properties. It is generally acknowledged that the stoichiometric CoGe2 and NiGe phases are best suited for ohmic metal contact formation, mainly due to their low resistivity. It is worth noting that the bulk phase diagram is limited in its use for nanoscience due to an increased surface/volume ratio as well as by the strong nanostructure/substrate interface influence.
This PhD thesis sheds light on the formation process at the atomic level of Co and Ni germanide nanostructures on clean, reconstructed Ge(001) substrates. The main part of the presented research is based on in-situ scanning tunneling microscopy (STM) studies on the influence of subsequent, post-evaporation annealings at various temperatures in order to follow and investigate on the nano-scale the structural evolution of a few monolayers of Co and Ni metal (deposited at RT and in UHV conditions) on an atomically clean, reconstructed Ge(001) surface. Furthermore, additional techniques like LEED, (S)TEM-EDX and XPS were used to corroborate and complement the STM derived insights.
It was demonstrated that - for both investigated systems - room temperature deposition of a few metal monolayers on clean Ge(001) results in a Volmer Weber growth mode. Starting with annealing treatments at relatively low temperature ranges, the formation of a continuous MetalxGey wetting layer from as-deposited 3D metal clusters on Ge(001) was detected. It should be noted that a very flat wetting layer was observed for the Co/Ge(001) system, which is different for the Ni/Ge(001) system where inhomogeneous terraced domains were formed. Finally, the 2D wetting layer gradually evolves with increasing temperature into well-ordered 3D MetalxGey nanostructures, surrounded by clean, reconstructed Ge(001). Analysis of these Co and Ni germanide nanostructures shows that the growth mechanism is different: in particular the Ni/Ge system is more reactive by means of Ni bulk diffusion and results in 3D Ni germanide nanostructures which show a strong tendency to be embedded into the Ge(001) substrate. In contrast, Co germanide nanostructures are situated initially on top of the Ge(001) substrate due to the fact that Ge diffusion dominates in the low temperature range. Only at higher annealing temperatures, Co diffusion into the bulk occurs and Co germanide nanostructures penetrate into the Ge substrate. For the Co- as well as Ni-Germanide system, the nanostructures undergo Ostwald ripening phenomena in the high temperature range. The present PhD thesis thus allows to understand on the nano-scale the main growth and reaction mechanisms of the Walser and Benè rule set up about 40 years ago to describe metal/semiconductor interface reaction on the macro-scale.
This thesis addresses fundamental physical processes which take place at the surface region of a target during and after the interaction with ultra-short laser pulses. The general goal is to bring together different phenomena and discuss the non-equilibrium nature of the interaction of femtosecond laser pulses (tp < 100 fs) with various materials, in particular dielectrics and semiconductors. Different experiments, using various techniques, are designed to explore the basic mechanisms of laser ionization, defect creation, electron-lattice energetic transfer, charged particles desorption, optical breakdown, phase transformations and surface morphological changes. Such processes are shown to depend strongly on the laser intensity. Thus, they are analyzed for intensities over four orders of magnitude (10^11-10^14 W/cm2), around the surface optical breakdown (damage) threshold intensity. First, experimental studies using time-of-flight mass spectrometry indicate that non-resonant intense ultra-short laser pulses can efficiently ionize a dielectric (semiconducting) material leading to emission of electrons as well as charged particles, i.e. atomic ions and large clusters, and neutral particles. Under these irradiation conditions, the ionization processes can be at best described by multiphoton ionization and ionization at defects sites. The structural defects provide the means for an increased positive ion desorption rate. A multiple pulse incubation effect in the ion yield can be well related with the reduction of the multi-pulse damage threshold with increasing intensity. Following the initial electron excitation and emission, positive ions are released from the surface in a substantial amount with high ion velocities indicative of a localized microscopic electrostatic expulsion. With increasing intensity, the amount of ions gets larger and larger and their velocity distribution exhibits a bimodal structure. Also, in these conditions, negative ions are detected. The ion desorption can arise from a combination of a localized electrostatic repulsion (macroscopic Coulomb explosion) and a thermal ‘explosive’ mechanism. The later becomes more important with increasing intensity. The very fast energy input and particle emission result in a transient perturbation and deformation of the target lattice. Using pump-probe experiments the temporal evolution of lattice dynamics can be analyzed upon single-pulse excitation for many different target materials. This deformation is indicated to be a material characteristic. It is associated with the generation of transient defects in dielectrics or fast phase transitions in semiconductors and metals. Therefore, it could well give estimates of lifetime of transient defect states or electron-phonon relaxation times.At last the surface morphology after ablation is analyzed, with emphasis on the laser-induced surface periodic patterns (ripples). The patterns observed appear to be very different from the ‘classical’ ripples formed after long pulse ablation. They can have periods much smaller than the incident wavelength and are rather insensitive to the variation of the laser wavelength and angle of incidence. We show that control factors are laser beam polarization and the irradiation dose. Additionally, the patterns exhibit features pointing toward a chaotic origin. Their possible formation mechanism is likely linked with the non-equilibrium nature of the interaction.