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Die stetig fortschreitende Miniaturisierung in der Halbleiterindustrie macht es notwendig, Oberflächenparameter mit Auflösung im Nanometerbereich zu messen und auch abzubilden. Von größtem Interesse sind hierbei das Oberflächenpotential und die Kapazität der oberflächennahen Bereiche, da diese Aussagen über die elektronische Struktur erlauben. Hierbei muss großes Augenmerk auf die Möglichkeit der zerstörungsfreien und präparationsarmen Messung gelegt werden, da jede Behandlung der zu untersuchenden Materialien deren Oberflächeneigenschaften ändert. Im Rahmen dieser Arbeit wurden auf der Atomkraftmikroskopie basierende Methoden sowohl experimentell als auch mit Hilfe von Simulationen auf ihre Anwendbarkeit für die Untersuchung von Halbleiteroberflächen evaluiert. Es stellt sich heraus, dass die kontaktfreien Methoden „Scanning Kelvin Probe Microscopy“ und „Scanning Capacitance Microscopy“ sehr gut geeignet sind, um die elektronische Struktur der Probenoberfläche qualitativ zu beurteilen. Allerdings muss für quantitative Aussagen ein recht großer rechentechnischer Aufwand betrieben werden.
In this thesis the detailed investigations concerning processing and stability of thin films including carbon species and their possible application as materials of a low dielectric constant (low k) are presented. In order to gather a complex information regarding the chemical, morphological and dielectric properties of the produced layer a combination of the spectroscopy: X-ray photoelectron spectroscopy (XPS), near edge X-ray absorption fine structure spectroscopy (NEXAFS) and Fourier transform infrared spectroscopy (FTIR), microscopy: atomic force microscopy (AFM) and electrical characterization: capacitance-voltage technique (CV) have been applied. The films deposited by means of variety of techniques have been described, ranging from evaporation, through spraying and dropping to spin-coating. Regarding the possible low-k application, a considerable attention has been paid to the hybrid organic-inorganic 3-aminopropyl-trimethoxysilane (APTMS) based composite materials enriched with carbon species coming from the following dopants: C60 fullerenes, [6,6]-phenyl-C61-butyric acid (PCBM), copper phthalocyanine (CuPc), and tris(dimethylvinylsilyloxy)-POSS (POSS). In the following thesis progressive steps leading to gradual decreasing of the resulting permittivity of the hybrid material is presented. As revealed by the performed investigations, the replacement of C60 within the APTMS based matrix by its better soluble derivative PCBM allows the increase of the concentration of the carbon species within the composite films. The introduction of POSS as an additional dopant gave the opportunity of increasing the resistance of the produced material against the ambient influence. With the excess of the POSS concentration an original fractal-shaped cluster formation has been observed. Finally, the dispersion of the properly chosen low concentration of CuPc and POSS molecules within the APTMS based matrix led to the fabrication of homogenous layer with an ultra-low dielectric constant of 1.8.