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This thesis comprises the development, accuracy testing and application of the so-called nanoDAC method (nano Deformation Analysis by Correlation). The method combines scanning probe microcopy (SPM) images and digital image correlation (DIC) to derive an in-situ deformation measurement technique. The results are full-field 2D displacement fields with nanometer resolution. The method can be performed on bulk materials, thin films, and on microelectronic components. A thermosetting polymer material typically applied in microelectronics systems serves as an example to emphasize the capability of the method. Crack tip opening fields of a compact tension (CT) specimen are experimentally determined by means of nanoDAC and the obtained fields act as the basis for the extraction of the stress intensity factor as a fracture mechanical property. In addition finite element analyses are carried out and an adaptation strategy between experimental and numerical results is developed.