@phdthesis{Mueller2010, author = {M{\"u}ller, Sebastian}, title = {Synchrotron radiation spectroscopy studies of the initial interaction of Chromium and Cobalt with the surface of Titanium Dioxide}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:co1-opus-18914}, school = {BTU Cottbus - Senftenberg}, year = {2010}, abstract = {In the framework of this thesis, synchrotron radiation based spectroscopy methods are applied to study the electronic structures of stoichiometric Rutile single crystals and TiO2 thin films, and the initial stage of chromium and cobalt growth on TiO2 thin films. Resonance photoemission spectroscopy of clean TiO2 at the Ti L2,3 edges led to Auger-like features, with kinetic energies corresponding to the Ti L2,3M4,5M4,5 Auger decay channels. The presence of these features is assigned to origin from a d2L2 charge transfer state. The resonance of the Ti L3M2,3V Auger channel at the Ti L2 edge is assigned to the L2L3V Coster-Kronig Auger, followed by the normal L3M2,3V Auger decay. The deposition of chromium on the TiO2 film causes a strong interaction at the interface, in which TiO(2-x) is formed together with chromium in the Cr 3+ state. Besides the oxidized component, contribution of metallic chromium is found as well. In the ultra-low coverage regime, post-deposition oxidation is observed, in which metallic chromium is oxidized to Cr2O3, accompanied by re-oxidation of the substrate to TiO2. The interface reaction is also reflected by the appearance of two defect states in the band gap. Resonant photo-emission at the Cr 2p and Ti 2p edges shows well distinguishable Cr 3d respectively Ti 3d character of the respective states. Indications for self-cleaning properties are found by removal of surface carbon during storage in UHV, but the influence of chromium on these properties is not studied in detail. The interaction between cobalt and TiO2 is weaker than that of chromium and TiO2. Nevertheless, an interface reaction is found, in which some of the deposited cobalt is oxidized, while the oxide support is partly reduced. The particular oxidation state of Cobalt is identified by means of multiplet calculation including charge transfer and crystal field effects. The calculated XAS and XPS spectra indicate Co 2+ in a tetrahedral coordination with four oxygen atoms. The metallic component of cobalt gives rise to a broad resonance in the valence band down to -20 eV, with a pronounced satellite feature that reflects the oxidized component.}, subject = {Spektroskopie; Titandioxid; Atomare Multiplett-Rechnung; Resonante Photoemission; Metall-Metalloxid-Wechselwirkung; Titanium dioxide; Metal/metal-oxide interaction; Multiplet-calculation; Resonant photoemission}, language = {en} } @phdthesis{Meyer2007, author = {Meyer, Moritz Andreas}, title = {Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects}, url = {http://nbn-resolving.de/urn:nbn:de:kobv:co1-opus-3509}, school = {BTU Cottbus - Senftenberg}, year = {2007}, abstract = {This thesis provides a methodology for the investigation of electromigration (EM) in Cu-based interconnects. An experimental framework based on in-situ scanning electron microscopy (SEM) investigations was developed for that purpose. It is capable to visualize the EM-induced void formation and evolution in multi-level test structures in real time. Different types of interconnects were investigated. Furthermore, stressed and unstressed samples were studied applying advanced physical analysis techniques in order to obtain additional information about the microstructure of the interconnects as well as interfaces and grain boundaries. These data were correlated to the observed degradation phenomena. Correlations of the experimental results to recently established theoretical models were highlighted. Three types of Cu-based interconnects were studied. Pure Cu interconnects were compared to Al-alloyed (CuAl) and CoWP-coated interconnects. The latter two represent potential approaches that address EM-related reliability concerns. It was found that in such interconnects the dominant diffusion path is no longer the Cu/capping layer interface for interconnects as in pure Cu interconnects. Instead, void nucleation occurs at the bottom Cu/barrier interface with significant effects from grain boundaries. Moreover, the in-situ investigations revealed that the initial void nucleation does not occur at the cathode end of the lines but several micrometers away from it. The mean times-to-failure of CuAl and CoWP-coated interconnects were increased by at least one order of magnitude compared to Cu interconnects. The improvements were attributed to the presence of foreign metal atoms at the Cu/capping layer interface. Post-mortem EBSD investigations were used to reveal the microstructure of the tested samples. The data were correlated to the in-situ observations.}, subject = {Elektromigration; Elektromigration; Kupfer; Leiterbahn; In-situ; Gef{\"u}ge; Electromigration; Cu interconnects; In-situ; Cu microstructure}, language = {en} }