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We have studied the anisotropic milling of Cu with respect to the milling rate and the milling topography, as well. The background is twofold: i) anisotropic milling has to be taken into account during the preparation of TEM specimens and in the manufacturing of micro parts from crystalline materials, and ii) the orientation depending milling behaviour can be used to generate topographies with specific properties with respect to, for example, adsorption, wear, and corrosion.
During focused ion beam microscopy (FIB) of crystalline materials imaging contrast and milling result are effected by orientation of the crystals with respect to the incident ion beam. This is due to the possibility of ion channeling along preferred crystal directions which effects the depth at which interaction between ions and specimen atoms takes place. As a result of channeling emission of ion induced secondary electrons (iiSE) and secondary ions (SI) as well as the sputter rate decreases.
Theoretical channeling orientations and critical angles can be calculated.
These effects have been studied quantitatively for polycrystalline recrystallized Cu as a typical model case.
Aluminium is still one of the most important contact metallisations for power electronic chips like MOSFETs or IGBTs. With a large difference in thermal expansion coefficients (CTEs) between aluminium and silicon and the temperatures generated in hot-spots during high power transients, these layers are prone to failure due to thermo-mechanical fatigue. Usually lifetime assessment is done by subjecting dedicated test specimens to standardised stress tests as e.g. active or passive thermal cycling. This paper proposes a novel method for accelerated stress testing and lifetime modelling of thin aluminium films in the high-cycle fatigue regime by isothermal mechanical loading. The proposed novel test method is suggested to complement or replace resource-demanding thermal cycling tests and allow simple in-situ monitoring of failure.